Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Design Services
The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat
Electronics Forum | Thu Mar 27 16:40:45 EDT 2008 | slthomas
(or just some static-safe foam tape) I need to seal a wire terminal block to a board for conformal coating purposes. Currently we glue it to a shim and glue the shim to the board (yuck), but I want to use die cut gaskets if I can make it cost effec
Electronics Forum | Sat Mar 29 12:05:09 EDT 2008 | davef
Install a gasket made of a non-esd safe material that can be die cut at a station equiped with an ionizer.
Used SMT Equipment | Adhesive Dispensers
MRSI-170 Gantry Adhesive Dispenser, die bonding, working condition, good for a project machine / prototype applications. FOB: Origin AssuredTechnicalServiceLLC@Gmail.com
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Used SMT Equipment | Adhesive Dispensers
Asymtek Millennium 600 Epoxy Dispenser For Sale Vintage 1998 Integrated mass flow calibration system automatically compensates for changes in fluid viscosity Full temperature control of fluid delivery with closed-loop substrate heating to
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
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Parts & Supplies | Assembly Accessories
N610009394AB/FILTER,STAINLESS STEEL KXFP6GB0A00,CONTROL UNIT FOR MOTOR KXFP6GB0A00,CONTROL UNIT FOR MOTOR MR-J2S-40B-EE085(PN-KXFP6GE1A00-0) N510015533AA,BALL SPLINE N210050456AB N210050456AB KXFA1PQ7A02 N210050452AA N210050452AA
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Panasonic Part Name: Fixed Blade Part Number: X01A51055H1 Machine: RHS2B Material: Black Mirror Steel Condition: New Stocks X01A51055H1 RH Seires AI Spare Parts RHS2B Fixed Blade For Panasonic Auto Insert Machi
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-underfill-small.php
Underfill Fluid Dispense on 6 mm Die Home Products Fluid Dispense Systems High Precision Dispenser - MAX Series Large Format Board Processing - DS Series Table Top Manufacturing Loader
ORION Industries | http://orionindustries.com/pdfs/300lse.pdf
. • Extremely smooth adhesive for excellent graphics appearance. • Polycoated kraft liner for die-cutting end tabs and waste removed nameplates on a common carrier. 3M™
