Industry Directory | Consultant / Service Provider
DCD is a leading IP Core provider and SoC design house. The company was founded in 1999 and since the early beginning is considered as an expert in IP Cores architecture improvements.
Our most advanced dispensing platform for electronics manufacturing The Vantage® Series is specifically designed for high-end advanced semiconductor package, electromechanical, and printed circuit board assembly. Create an unparalleled dispensing p
Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope
Electronics Forum | Fri Apr 17 14:08:44 EDT 1998 | Earl Moon
| Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else | have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare
Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.
Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order
.png)
Used SMT Equipment | Assembly Accessories
Panasonic's BM231 modular high speed multi-functional placement machine boasts any volume, any mix capability by placing a wide array of components from 0402 (01005) microchips to BGA's, CSP's and connectors. Outstanding productivity is a
Used SMT Equipment | THT Equipment
Save on hard to find General Production Devices CF-9/CF-10 radial lead component cut and form die sets lot. Domestic and international shipping is available.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Parts & Supplies | THT Equipment
PCB MMINT 44024101 THETA MOTOR ASSY 47598202 THETA ENCODER ASSY 47509501 Z MOTOR ASSY 47598201 THETA ENCODER ASSY 44714001 CLUCTH UNITIZED 1.5 49752106/50121207 CLUTCH ASSY 45762701 MIRROR CLUCTH FJ 50121208 MIRROR CLUCTH FJ 50151806 CAP 42342901 HD
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope
Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
Career Center | Bangalore, Karnataka India | Sales/Marketing
Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
ORION Industries | http://orionindustries.com/die-cutting.php
& Die Stamping Since 1973, die-cutting and die stamping has been at the core of Orion Industries Incorporated. From the beginning where we started with a simple swing arm press and small stamping press, to our state of the art pressroom housing 4 high speed Preco die cutting presses, Orion has created an
| https://www.wesource.com/wire-and-die-bonders/?p=catalog&mode=catalog&parent=30&pg=1&CatalogSetSortBy=name
Wire and Die Bonders: World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US: 858.693.1991 Home About Us Contact Us Categories AOI Assembleon Machines Assembleon Parts Batch Ovens and Chambers Component Counters/Tapers Component Placers (Pick
