New SMT Equipment: dima pp 0,0 (1083)

Original New Yokogawa Supply VI702 S1

Original New Yokogawa Supply VI702 S1

New Equipment | Industrial Automation

Welcome to us for a QUOTE. sales5@cambia.cn (Unik You) +86 18030205725 (skype/ whatsapp) Most PLC & DCS items in stock!!  AB BENTLY ABB FOXBORO GE FANUC 1745-LP151 1900/65A-01-15-02-02-01 HIEE200072R2&n

Cambia Automation Limited

Original New Yokogawa Supply VI701 S1

Original New Yokogawa Supply VI701 S1

New Equipment | Industrial Automation

Welcome to us for a QUOTE. sales5@cambia.cn (Unik You) +86 18030205725 (skype/ whatsapp) Most PLC & DCS items in stock!!  AB BENTLY ABB FOXBORO GE FANUC 1745-LP151 1900/65A-01-15-02-02-01 HIEE200072R2&n

Cambia Automation Limited

Electronics Forum: dima pp 0,0 (16)

Dima's Pick and Place Machines and other low volume P&P

Electronics Forum | Thu Apr 26 13:20:45 EDT 2007 | SMT Guy

Where are you located? If in US, support for DIMA equipment is through Manncorp. Not a source I would put my money on.

Dima's Pick and Place Machines and other low volume P&P

Electronics Forum | Fri Apr 27 16:43:21 EDT 2007 | grantp

Hi, MYDATA is made is Sweden. Grant

Parts & Supplies: dima pp 0,0 (2)

DIMA SMCS-5000 (stick feeder)

DIMA SMCS-5000 (stick feeder)

Parts & Supplies | Pick and Place/Feeders

We have 7 pcs Dima SMCS-5000 (stick feeder) in good condition Can be used on many machines: Dymaxion ATOZ PP-050 HP-090, HP-095, HP-100, HP-110 Modulo MP-100, MP-200 In case of interest please contac us for pricing.

TwenTech Production Equipment & ATE

DIMA SMCS feeders for sale

DIMA SMCS feeders for sale

Parts & Supplies | Pick and Place/Feeders

we have many Dima feeders in stock: SMCS-4008 SMCS-4008-1 SMCS-4012 SMCS-4016 SMCS-4024 SMCS-4032 SMCS-4044 SMCS-5000 Can be used on many machines: Dymaxion ATOZ PP-050 HP-090, HP-095, HP-100, HP-110 Modulo MP-100, MP-200

TwenTech Production Equipment & ATE

Technical Library: dima pp 0,0 (77)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Stencil Printing 008004/0201 Aperture Components

Technical Library | 2020-04-14 15:56:32.0

This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.

ITW EAE

Express Newsletter: dima pp 0,0 (19)

Partner Websites: dima pp 0,0 (6)

Unisoft - PCB Pick and Place assembly machine software - electronic manufacturing services CEM, EMS,

| https://unisoft-cim.com/place_download.htm

viewed in the Unisoft software. Also it is recommended that the point that is chosen for MARK REFERENCE 1  on the top side is also set to the XY 0,0 origin of the PCB using the SET ORIGIN feature.  By doing this the coordinates displayed for the components


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