Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2020-01-01 17:06:52.0
The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.
SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P
LED Side Concave 2-Pin LED Side Concave 4-Pin Metal Electrode Leadless Face Diode (MELF) Metal Electrode Leadless Face Resistor (MELF
), SO28, SOT223, SOJ20, PLCC32, MELF, SOD, TSOP Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 18.6 x 18.6 x 5.60 mm (0.73” x 0.73” x 0.22”) (PLCC44) COMPONENT RANGE HIGH PRECISION MOUNTHEAD