Electronics Forum: diode, melf cracking (5)

Re: Cracked Capacitors

Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW

Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf

Re: Cracked Capacitors

Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff

Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from

Industry News: diode, melf cracking (1)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Technical Library: diode, melf cracking (3)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Temperature Cycling and Fatigue in Electronics

Technical Library | 2020-01-01 17:06:52.0

The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.

DfR Solutions

Express Newsletter: diode, melf cracking (48)

SMTnet Express - December 23, 2015

SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P

Partner Websites: diode, melf cracking (13)

3D STEP - Surface Mount Passive

PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/3D-STEP_SM-Passive.asp

  LED Side Concave 2-Pin   LED Side Concave 4-Pin           Metal Electrode Leadless Face Diode (MELF) Metal Electrode Leadless Face Resistor (MELF

PCB Libraries, Inc.

AB59829 MY300SX Specification May 2017.indd

Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf

), SO28, SOT223, SOJ20, PLCC32, MELF, SOD, TSOP Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 18.6 x 18.6 x 5.60 mm (0.73” x 0.73” x 0.22”) (PLCC44) COMPONENT RANGE HIGH PRECISION MOUNTHEAD

Baja Bid


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