Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Technical Library | 2012-08-02 21:05:14.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
SMTnet Express, June 4, 2015, Subscribers: 22,829, Members: Companies: 14,364 , Users: 38,296 Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers David Pinsky, Elizabeth Lambert; Raytheon Integrators and designers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/pelletizing-compounding?con=t&page=34
. Nordson SELECT to Exhibit Cerno 103IL Selective Soldering Equipment Nordson SELECT Cerno™ 103IL selective soldering system features interchangeable tin-lead and lead-free solder pots and advanced process controls Product Catalog Request Nordson SEALANT EQUIPMENT For a printed copy of our
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. Process benefits of nitrogen include the use of lower melting point paste formulations (195°C) and improved solder flow and wetting angles. Nitrogen also may reduce discoloration caused by the higher
