Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Industry News | 2020-04-14 18:22:06.0
The U.S. Patent and Trademark Office has issued Patent No. 10,434,537 protecting Dynamic Dual Head™ (DDH) dispensing technology for the Camalot® Prodigy™ Dispenser. The Prodigy Dispenser employs breakthrough technology that delivers high-speed, extremely accurate materials dispensing for electronics assembly and packaging with tighter tolerances, and higher yields.
Industry News | 2019-05-01 20:22:28.0
ITW EAE is proud to announce that it has earned a coveted VA Excellence Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented during the 13th Vision Awards program at Nepcon China.
Industry News | 2020-04-14 18:17:46.0
ITW EAE has earned a coveted Global Technology Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented to Camalot Prodigy Business Manager, Hugh Reed and Engineering Manager Scott Reid during a ceremony at Productronica in Munich Germany.
Industry News | 2019-11-05 12:00:26.0
Nordson ASYMTEK introduces more products and solutions to create reliable and efficient conformal coating and dispensing processes in electronics manufacturing at Productronica 2019 in Hall A2, stand 345.
Industry News | 2014-02-13 23:58:33.0
Nordson ASYMTEK introduces the Quantum™ Q-6800 high-performance, large-format dispensing system for SMT, PCB packaging, and microelectronics assembly applications. Quantum’s dispense area of 423 x 458 mm handles a wide range of substrate sizes and is large enough so the dispense area isn’t compromised even with dual valve configurations, enabling flexibility in the dispensing process.
Industry News | 2020-01-23 17:30:46.0
ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.
Industry News | 2017-05-24 17:05:03.0
Nordson ASYMTEK received two prestigious awards for innovative technology during NEPCON China 2017: the Innovation Award from Electronics Manufacturing (EM) Asia in the category of Special Systems--Dispensing Systems and the VISION Award for Innovative Products & Services in Surface Mount from SMT China magazine in the Dispensing and Conformal Coating category. The awards were presented for achievement in innovation and product excellence for Nordson ASYMTEK's Auto Dual Simultaneous (ADS) System. Nordson ASYMTEK products have received these awards every year the awards were in existence.
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
