Organizations who routinely import products into the United States will profit significantly from a continuous bond. More practical and proficient than a single entry bond for regular shippers/importers, a continuous bond permits you to imp
New Equipment | Cleaning Equipment
Plasma Cleaner Low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning. Application: LCM, IC Packaging (Flip Chip, CSP, BGA, Lead F
Electronics Forum | Sun Apr 05 07:00:31 EDT 2015 | vitrost
After washing a tetra bond stencil at PBT machine (Vigon SC200, 50 deg Celsius by 20 minutes) some signs of glue degradation were seen. Does anybody have an experience washing tetra bond in Vigon? What temperature regime is preferable? Thanks
Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD
Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-lamination-voids-in-pcb-manufacturing/
. Blistering generally occurs on the solder mask layer, which does affect performance but is largely an aesthetic issue. Delamination occurs deeper within a printed circuit board, directly influencing the interlaminar bond strength
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