Industry News: dow corning 1-2577 (Page 1 of 8)

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Five Speakers

Industry News | 2008-10-25 22:05:53.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Harald Wack (Session Chair) of Zestron Corporation, Jason Keeping of Celestica, Barry Richie of Dow Corning Corporation, Phil Kinner of Humiseal, and Lamar Young of Specialty Coating Systems will present in Session 5 on Conformal Coating Adhesion. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Association Connecting Electronics Industries (IPC)

IPC and SMTA Announce Session 3 Agenda for High Performance Cleaning and Coating Conference

Industry News | 2010-10-07 13:23:20.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 3 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Association Connecting Electronics Industries (IPC)

Session 2 Agenda for the High-Reliability Cleaning and Coating Conference

Industry News | 2012-10-18 19:02:31.0

IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to Electronics Industry and IPC More than 80 Awards Presented at IPC Midwest

Industry News | 2012-08-22 15:57:01.0

IPC – Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest Conference & Exhibition

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

IPC-HDBK-850 Sets Guidelines for Potting and Encapsulating Boards

Industry News | 2012-08-09 18:42:34.0

IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

Association Connecting Electronics Industries (IPC)

IPC Committee Members Honored for Contributions to Electronics Industry and IPC More than 130 Awards Presented at Fall Standards Development Committee Meetings

Industry News | 2013-10-21 16:05:48.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas.

Association Connecting Electronics Industries (IPC)

IPC Honors Members at APEX 2002

Industry News |

Association Connecting Electronics Industries (IPC)

2002-01-31 09:33:43.0

> FREE Registration for June 12-13, held in The Netherlands

Industry News | 2013-05-01 12:45:51.0

Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht

ASYMTEK Products | Nordson Electronics Solutions

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