Industry News: dowel (Page 1 of 1)

See GPD Global's PCD Technology at IMAPS Device Packaging 2011

Industry News | 2011-02-17 15:04:54.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.

GPD Global

FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011

Industry News | 2011-02-14 16:47:35.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

Finetech

Aegis Software Partners with Schools to Bolster Interest in STEM Fields

Industry News | 2016-09-11 12:24:06.0

In the United States, producing an adequate number of college graduates who are prepared for careers in Science, Technology, Engineering, and Mathematics (STEM) has proved challenging. With the share of STEM degrees just 16% of degrees granted per year, employers in these fields often struggle to recruit highly-skilled workers despite offering compelling compensation packages. Having a division in Germany where the partnership between business and education is the norm, Aegis has a real appreciation for its value to both the businesses and a nation as a whole. By supporting students’ education via internships, businesses effectively cultivate their next generation of engineers, scientists and mathematicians. For the students, they have the opportunity to learn how theoretical subjects they learn in the classroom are applied in a workplace setting.

Aegis Industrial Software Corporation

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