Electronics Forum | Fri Dec 10 10:25:59 EST 1999 | Wolfgang Busko
Hi Larry, you might find something looking for the thread "D-Pak misalignment Problem - Kantesh Doss 23:43:23 12/02/1999" Good luck Wolfgang
Electronics Forum | Wed Apr 17 02:30:03 EDT 2002 | seje
Hello. There is been a lot of talk about thick plastic stencils vs. metal stencils for adhesive printing, but how about thin plastic stencils? We used to use a very thin plastic stencil (from loctite) with printgap (=snap-off) to adhesive printing
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Thu Mar 08 14:30:45 EST 2007 | ratsalad
If you are in the middle of a run and can't get a replacement stencil there immediately, you can always put a little kapton tape on the bottom of the stencil to mask off a portion of the DPAK pad and reduce the paste deposit. We have had to do this
Electronics Forum | Fri Jun 03 15:18:04 EDT 2005 | mmjm_1099
Hello, I was wondering about specs on SMT stencil ordering. I am looking to make some sort of template for aperature layout of some parts. I was wondering some issues that you have all came across or made to change to better suit your boards. For ins
Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto
Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa
Electronics Forum | Sat Dec 04 09:42:18 EST 1999 | Chris McDonald
Just as explained in a follow-up you are getting too much paste on the pad. The pad is probably the right size but you cant have your aperature the same size as your pad. What we have done is put a Cross in the stencil. This will reduce the paste and
Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink
We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance
