SMT Online AOI Machine ZW 810 Inspection Component: 0201 chip PCB size::25x25-480*330mm Dimension:900*950*1600 mm Weight: 650kg Product description: SMT Online AOI Machine ZW 810, Inspection Component: 0201 chip, PCB size::25x25-480*330mm, Di
SMT AOI Machine ZW800 Inspection Component: 0201 chip PCB size::25x25-480*330mm Dimension:980*1080*1410 mm Weight: 600kg Product description: SMT AOI Machine ZW800, Inspection Component: 0201 chip, PCB size::25x25-480*330mm, Dimension:980*10
Electronics Forum | Mon Jun 14 07:41:47 EDT 1999 | Vinesh gandhi
Dear All, We are having a big debate over what is the industry standard in DPPM on the wave sodlering process. is a DPPM of about 800 satisfactory. As per our big bosses it should not be more than 50 DPPM. Is the figure realistic. We are typicall
Industry News | 2015-04-03 16:04:35.0
New Real Time Audit (RTA) Tool for the UltraFLEX platform.
Industry News | 2020-10-31 10:25:58.0
NEOTech is proud to announce that it was awarded a 2020 Mexico Technology Award in the Contract Services category. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Career Center | Gurgaon, Haryana India | Management
� Heading daily morning meeting with all program managers, materials manager, test engineering manager, process engineering manager, quality control manager, planning manager, stock room manager, shipping department head. Discussion about incoming or
Career Center | Danao city, Cebu Philippines | Engineering,Maintenance,Production,Quality Control
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