Industry Directory | Manufacturer
Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.
Industry Directory | Manufacturer
Bosch Static Control is a specialist in ESD & CLEANROOM Production Items and has several years experience in this specialist field.We have our very own production Facilties in Dongguan, China
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
solder paste printing is a critical step in the SMT PCB production, Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly,high q
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Fri Nov 03 15:43:20 EDT 2017 | dleeper
IPA and DI water are both very common and effective methods of cleaning PCBAs. http://www.zestron.com/sa/cleaning-applications/smt-electronic-cleaning/pcba-cleaning/aqueous-cleaning.html http://blog.gotopac.com/2010/11/18/ipa-as-a-universal-cleaner
Used SMT Equipment | Pick and Place/Feeders
Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mmcomponents, the wide range of special-shaped long joint element The height of the object elementcorresponds to 25.5 mm 10 ~ 30 n can be easy to stick
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Industry News | 2018-06-13 12:52:51.0
Market's first non-reversible humidity indicator Card Type 2 is low-halogen and cobalt-dichloride-free. Complies with the latest revision of IPC/JEDEC standard, J-STD-033D.
Industry News | 2018-08-21 14:28:35.0
Clariant's new Humitector Type 2 Non-Reversible Humidity Indicator Cards contain a patent-pending non-reversible 60% humidity spot indicator which enables them to indicate whether dry packed surface mount devices (SMDs) have been exposed to high levels of moisture at any point during shipment or storage. This unique innovation offers a major step forward in preventing moisture-compromised surface mounts from entering production.
Parts & Supplies | SMT Equipment
Juki Genuine Parts JUKI FX-1 FX-1R Y CABLE BEAR L140E321000 TKP0450 58B R95 Specifications: Brand Name JUKI PLASTIC RAIL Part number L140E321000 Model TKP0450 58B R95 Ensure Test in machine confirmation Guarantee 1 month usage for machi
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Parts & Supplies | Pick and Place/Feeders
JUKI 2060 solenoid valve 40072402 40001266 Other juki parts: 40071680 BASE IO PCB ASM 40071805 TM FRANGE 40071849 JIG PWB 40072344 RELEASE_BAR_L 40072345 RELEASE_BAR_R 40072349 HAND KNOB ASM 40072388 SW PANEL 40072401 EJ OUTSIDE FILTER EXCHA
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/industries/life-sciences?con=t&page=7
. No more, no less. With instant flow adjustment – no wait time for pads or rollers to become wet or dry out. 2K Pneumatic Dispense Gun
