Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
SMTnet Express September 5, 2013, Subscribers: 26246, Members: Companies: 13466, Users: 35123 Conformal Surface Plasmons Propagating on Ultrathin and Flexible Films by Xiaopeng Shen,Tie Jun Cui,Diego Martin-Cano, Francisco J. Garcia
