Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe
As part of a maintenance cleaning program, the most prevalent types of contamination, such as burnt-in fluxes and condensed gas emissions from the soldering process, must be removed to ensure a reliable and failure-free production process. Other are
Electronics Forum | Tue Mar 15 10:18:15 EDT 2011 | grahamcooper22
Hi, Does anyone have any experience of cleaning lead free solder paste residues off pcbs in a vapour degreasing process using Ensolv Ionic ? Any guide as to the best cleaning cycle would be appreciated. thanks
Electronics Forum | Thu Mar 17 09:53:20 EDT 2011 | rperkins
Hi Graham, I've worked in the industry selling EnSolv, Lenium, and now ENTRON solvents, which are all based on stabilized NPB. These solvents do not always clean the no lead pastes. The problem is that the pastes are becoming more like adhesives,
MPM-COOKSON, Serigraphic printing machine, type SPEEDLINE ULTRAPRINT 3000 - UP 3000/A, s.n. UO826/RF, with contrast support pins, online automatic frame cleaning (paper and solvent), double center camera 2D ( fiducial control 2D paste inspection), in
Upgraded and maintainted over the years Previously owned by military contractor High pressure pump for SMD cleaning Computer controlled and monitored Designed for solvent-based cleaning and testing applications Multiple Cleaning T
Industry News | 2009-04-21 13:58:29.0
TORRANCE, CA � April 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit the Sawa SC-500GE portable cleaner, as well as product literature for all Seika products at the upcoming SMTA Toronto Tabletop Exhibition, scheduled to take place May 20-21, 2009 at the Crowne Plaza in Toronto, ON.
Industry News | 2016-10-20 19:30:08.0
ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present “Power Electronics Cleaning - Solvent to pH Neutral: Enhancing Safety, Process Efficiency and Productivity” at the IPC- SMTA High-Reliability Cleaning and Conformal Coating Conference in Rosemont, IL.
Specification Product name stencil cleaning roll Material 55%Wood pulp+45%polyester Inner core material Plastic or paper or customized Size customized size Color White Weight 56gsm, 60gsm, 65gsm OEM Logo,size,weight,packing,inner core materia
We have original new and original used in stocks, We also can repair the motherboard to save the cost G4S300-B Motherboard ( CPU Board) for DEK SMT Screen Printing Equipments DEK VISION Y AXIS SERVO MOTOR 133128/160706/145520 DEK RISING TABL
Technical Library | 2009-01-06 00:06:30.0
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
VIGON® EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. VIGON® EFM is a mixture of halogen-free, organic solvents. It dries fast and residue-free. VIGON® EFM is non-corrosive and co
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
SMTnet Express, July 28, 2016, Subscribers: 25,879, Companies: 14,883, Users: 40,795 Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware Mike Bixenman, DBA - Kyzen Corporation
Dipropylene glycol DME inerit solvent Suchen Share Region Kontakt Schliessen Schliessen Suchen If you are searching for Safety Data Sheets, please visit our Document Finder Alle Ergebnisse Schliessen
Aqueous Technologies Trident III Duo Batch Wash Cleaner-2010 - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal