Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
Electronics Forum | Wed Feb 06 09:40:05 EST 2008 | phouwen
We are experiencing some difficulty in BGA assembly and would like to do some periodic on site dye and pry after different assembly processes. Does anyone do this now? Is it actually feasible? Does anyone have recomendations on equipment/dye suppl
Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp
We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.
Industry News | 2010-08-09 15:27:51.0
In an effort to accommodate companies recovering from the struggling economy, SMTA is offering valuable free events and cost-saving options for SMTA International attendees in addition to the strong technical conference for which they are renowned. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010.
Industry News | 2011-12-02 18:36:19.0
Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
. The company also offers cross-sectioning, dye & pry, and analytical laboratory services, including SEM and C-SAM analysis; counterfeit component identification and detection
. Mehr Ink Jet Yellow HG 01 VP 6252 Ink Jet Yellow HG 01 VP 6252 is a specially designed inkjet gradepigment, particular for aqueous applications