PRI is a global provider of customer-focused solutions designed to improve process and product quality by adding value, reducing total cost and promoting collaboration among stakeholders.
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
MANUFACTURER Siemens MODEL 6ES7412-2EK06-0AB0, Siemens Simatic S7 Central Processing Unit GUARANTY 1 year CONDITION Original and brand new ANY INQUIRY ABOUT PLC & DCS PRODU
Electronics Forum | Wed Feb 06 09:40:05 EST 2008 | phouwen
We are experiencing some difficulty in BGA assembly and would like to do some periodic on site dye and pry after different assembly processes. Does anyone do this now? Is it actually feasible? Does anyone have recomendations on equipment/dye suppl
Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp
We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.
2014, Manncorp PB2300 semi-auto solder paste screen printer, with vision, good working condition. Also available with a 2014 Manncorp reflow oven and a 2008 MC387-V2 with feeders FOB: Origin / Ex-works Contact: AssuredTechnicalServiceLLC@Gmail.
JDSU HST-3000-DSLR JDSU HST3000 Handheld Tester Portable test set addressing the needs of Layer 1 thru Layer 7 testing with IPv6 Capability Handheld, modular platform for copper and multi-service testing Highlights Support for Electric
Industry News | 2011-12-02 18:36:19.0
Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
44/56MM guide pulley MTKP001528AA 44/56MM guide pulley MTKP001528AA CM402/CM602 solenoid valve CM402/CM602 cutter solenoid valve N510029538AA/ KXF0DR6AA00:VQZ1321Y-5MO-C6 CM402/CM602 cutter solenoid valve group N510028350AA :VV5QZ12-03-X132CM402/
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 1999-05-09 13:05:12.0
This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
Career Center | , | Maintenance,Management,Quality Control,Technical Support
Software: Over 14 years experience in operating and maintaining of different types of Telecommunication and IT equipments � Proven proficiency in operating and maintaining of TDM telecommunication equipment - digital exchanges AXE10 (Ericsson) � Pr
Technical Considerations for Controlling ESD in Electronics Manufacturing Technical Considerations for Controlling ESD in Electronics Manufacturing As device geometries get smaller and processing speeds grow faster, their ESD sensitivity increases
An Effective Design of Experiment Strategy to Optimize SMT Processes An Effective Design of Experiment Strategy to Optimize SMT Processes It is now widely accepted that using designed experiments is the most effective way to optimize surface mount
. The failure analysis topics included are: Decapsulation/delidding Dye and pry testing Microsectioning Qualification of bare boards and assemblies The characterization methods included are
) Thermal Cycling Thermal Shock Thermal Stress Temperature/Humidity Testing Vibration/Mechanical Testing + Mechanical Testing Adhesion Coating Thickness Cross-Sectional Analysis Die Shear / Wire Bond Testing Dimensional Analysis Dye and Pry Testing Microsectioning Non-Destructive Wire Bond Pull Testing