Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr
Electronics Forum | Fri Apr 02 11:23:44 EST 2004 | pjc
ECD has some advantages in terms of upgrade path. Once you buy the ECD SuperM.O.L.E., you can use it in a OvenRIDER, WaveRIDER and ReworkRIDER products. The OR, WR and RR are solder machine management devices for solder process control. Where profile
Electronics Forum | Fri Apr 02 15:59:04 EST 2004 | russ
Matt, are you still just doing SIPAD? If so, Manncorp has a profiler for about $1k It requires a p.c. to be hooked up while profiling and it won't take data points any faster than 1 point every 2 seconds. but could be adequate for your needs. (www.
12 Heated Zone (160") & 4 Cooling Zones (54") Pin Chain Conveyor with Center Board Support: N2 Ready Software Version 3.3.0c * Includes ECD XPERT Mole Profiling Unit with internal ECD computer profiling software (Overwatch 1.12B and SuperMole Gol
ECD M.O.L.E. Lot comes with the following, everything is complete and fully functional, manuals included, plus and spare parts. 1) ECD M.O.L.E. Xpert 3 profile module 2) ECD Xpert 3 Docking station 3) SUPER M.O.L.E. Gold thermocouple system. 4) ECD O
Industry News | 2012-11-05 14:21:13.0
ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Technical Library | 2014-12-04 18:27:40.0
A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.
Technical Library | 2018-11-14 21:43:14.0
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.
This wizard guides a user through the communications setup process so the software and M.O.L.E. can communicate. Categories: OvenRIDER, OvenRIDER SPC (v5.2x)
Career Center | Melbourne, Florida USA | Engineering
I have over 24 years experience in the PCB manufacturing arena. My career knowledge is in most SMT manufacturing equipment. Creating and troubleshooting manufacturing assembly processes and creating detailed work instructions using Microsoft Power
Career Center | Sparks, Nevada USA | Engineering,Management,Production
Felix Gutierrez Bueno 3906 Dominus Drive, Sparks. NV. 89436 Cel: 775-313-2975 firstname.lastname@example.org *SMT Manager * Sr. SMT Process Engineer * Manufacturing Engineer * Maintenance and repair Supervisor * Background Broad Experience serving as:
SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured Articles Engineering Robust Relow Profile Design by Bob Rooks , ECD, Inc. There is little literature on the engineering
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 99, (#ts#)) SMT Express, Volume 4, Issue No. 2 - from SMTnet.com Volume 4, Issue No. 4 Thursday, April 18, 2002 Featured