Industry News | 2009-10-16 16:10:36.0
User-Configurable Process Audit Tool
Industry News | 2019-06-26 20:03:21.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on Monday, June 17 at IPC’s SummerCom Standards Development Committee Meetings in Raleigh, N.C. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2018-03-14 18:46:31.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2017-10-31 18:46:42.0
At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
Industry News | 2012-11-05 14:21:13.0
ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Industry News | 2015-11-01 16:14:06.0
High-mix, medium-volume contract manufacturer, EI Microcircuits specializes in high-quality design, engineering and production of PCBs used in the industrial controls, medical and government sectors. With diverse and multiple jobs running throughout the Southern Minnesota-based EMS firm’s three facilities, ensuring tight reflow soldering processes is critical to high-yield and cost-effective manufacturing. For this important assembly process, EI Microcircuits relies on ECD’s M.O.L.E.® thermal profiling and OvenRIDER® technologies.
Industry News | 2017-03-01 14:41:48.0
ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
Industry News | 2016-04-07 10:40:38.0
At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.
Industry News | 2015-11-18 18:44:38.0
BTU International today announced that it has partnered with thermal measurement innovator ECD in a joint development initiative to integrate the company’s new Recipe Generator technology directly into BTU’s Wincon furnace operating system. ECD’s Recipe Generator is currently available through ECD’s M.O.L.E. series of thermal profiling systems, and the new integrated feature will be released in early 2016 as part of BTU’s Pyramax reflow product line. The technology will be the industry’s most comprehensive recipe prediction tool to-date, due to its process settings for zone temperatures and belt speed, which take into account the convection rate -- the most significant element of heat transfer.
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