Front End and Back End Yaskawa Wafer Robots, Ebara Pumps, Boc Edwards Pumps, Affinity Chillers, ASM, Karl Suss, Agilent, Tencor, EVG, GSI, ESEC, Besi, Kulicke and Soffa, K&S, MRSI, Temptronic View our inventory or call us at 978-790-2774
Electronics Forum | Mon May 18 13:09:55 EDT 1998 | Edward P. Woldendorp, TwenTech
Wanted: by customer in the Netherlands: + used Zevatech PM575 SMD machine or comparable make and type having .4mm pitch and Vision. Capicity: 4,000 comp/hour will do. If available please give full configuration, age, location, asking price. Thank you
Industry News | 2014-08-12 18:49:24.0
ZESTRON will host a free “Assembly, Cleaning, Coating, and Reliability” workshop together with Aqueous Technologies, Henkel and Quantum Systems in Scottsdale, AZ, on Tuesday, September 16th.
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
– Celestica, Jason Keeping S1: Adhesives for reinforcing components - Henkel, David Edwards S2: Plasma Treatment Enables Optimum Dispensing Characteristics - Nordson MARCH, Dave Foote Roundtable Discussion I Lunch (provided) S3