Industry Directory: effectiveness microvia (3)

Lloyd Doyle

Industry Directory |

Lloyd Doyle designs, manufactures and markets sophisticated automatic optical test (AOT) systems used in the bare board sector of the printed circuit board manufacturing industry.

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies

New SMT Equipment: effectiveness microvia (1)

PE-100 Plasma Etch Benchtop Plasma System

PE-100 Plasma Etch Benchtop Plasma System

New Equipment | Prototyping

Compact Plasma Etcher The PE-100 is a complete system with vacuum pump designed to be reliable yet inexpensive enough to allow startup companies, medical labs and R&D facilities the opportunity to experience Plasma Etch technology. The all aluminum

Plasma Etch, Inc.

Electronics Forum: effectiveness microvia (8)

via under a smd pad ?

Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef

There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio

Void in CSP

Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef

Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;

Industry News: effectiveness microvia (11)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

IPC to Host High Reliability Forum in Baltimore Technical conference to focus on electronics subjected to harsh use environments

Industry News | 2018-05-01 19:25:27.0

Mil-aero and automotive engineers who want to increase their knowledge of electronics subjected to harsh use environments should attend IPC’s High Reliability Forum in Linthicum (Baltimore), Md., May 15-17, 2018.

Association Connecting Electronics Industries (IPC)

Technical Library: effectiveness microvia (4)

The Proximity of Microvias to PTHs And Its Impact On The Reliability

Technical Library | 2007-05-09 18:26:16.0

High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this research, the effect of the proximity of microvias to Plated Through Holes (PTHs) and its effect on the reliability of the microvias was extensively evaluated. The reliability of microvia interconnect structures was evaluated using Liquid-To-Liquid Thermal Shock (LLTS) testing (-55oC to +125oC). Comprehensive failure analysis was performed on microvias fabricated using different via fabrication technologies.

Universal Instruments Corporation

Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias

Technical Library | 2016-11-30 15:53:15.0

The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.

Raytheon

Events Calendar: effectiveness microvia (1)

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: effectiveness microvia (397)

SMTnet Express - July 14, 2022

SMTnet Express, July 14, 2022, Subscribers: 25,319, Companies: 11,585, Users: 27,344 █  Electronics Manufacturing Technical Articles Reliability Testing For Microvias In Printed Wire Boards Traditional single level microvia structures

SMTnet Express - December 1, 2016

SMTnet Express, December 1, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias Edward Arthur; Raytheon , Charles Busa, Wade Goldman P.E., Alisa

Partner Websites: effectiveness microvia (2)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ Dwayne R. Shirley et al. Abstract 17-1 LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS Marie Cole et al. Abstract 17-1 ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES Harjinder Ladhar and Sundar

Surface Mount Technology Association (SMTA)


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