New SMT Equipment: eightech air solder nis-20-82c electrical rating (288)

Air Circulation Reflow Oven A Series

Air Circulation Reflow Oven A Series

New Equipment | Reflow

Quick Overview Air Circulation Lead-Free Reflow Oven With 8/10/12 controlled upper and lower air cirulation heating zones,the E- thermal A8/A10/A12 Series SMT reflow ovens, with thermal accuracy of ±1˚C. Air Circulation Reflow Oven A Series Featur

1 CLICK SMT TECHNOLOGY CO., Limited

Lead Free Reflow Oven Microjet-N Series

Lead Free Reflow Oven Microjet-N Series

New Equipment | Reflow

With 8/10/12 controlled upper and lower Microjet heating zones,the Microjet-N8/N10/N12 Series SMT reflow ovens, with thermal accuracy of ±1˚C, Patent design with micro nozzles spray hot air and with holes around nozzle to take hot air back, so to mak

1 CLICK SMT TECHNOLOGY CO., Limited

Electronics Forum: eightech air solder nis-20-82c electrical rating (3)

SMT Lines' Facilities Requirement

Electronics Forum | Thu Sep 29 10:21:11 EDT 2011 | davef

1. Floor loading requirement - The designer of your factory building specified the flooring with a certain floor loading capability. You need to determine that capability. You plan to install machines and equipment. You need to determine the weight o

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 08:18:29 EDT 2017 | rob

It's well documented in higher power semiconductors where thermal interface materials are used, such as SIL pads, thermal grease etc. There are a couple of papers on the effects of voiding on MOSFET performance, but I haven't got around to reading

Used SMT Equipment: eightech air solder nis-20-82c electrical rating (5)

SEHO GoWave 1030 Solder Wave

SEHO GoWave 1030 Solder Wave

Used SMT Equipment | Soldering Equipment/Fluxes

Solder Wave by SEHO, in good condition. SEHO GoWave 1030 product information. Usable soldering width max. 340 mm [13.39”] Pass-through height (measured from bottom edge of PCB) 100 mm [3.94”] PCB / solder mask dimensions l x w max. 410 x 340 m

Fix Trade BV

SEHO GoWave 1030 Solder Wave

SEHO GoWave 1030 Solder Wave

Used SMT Equipment | Soldering Equipment/Fluxes

Solder Wave by SEHO, in good condition. SEHO GoWave 1030 product information. Usable soldering width max. 340 mm [13.39”] Pass-through height (measured from bottom edge of PCB) 100 mm [3.94”] PCB / solder mask dimensions l x w max. 410 x 340 m

Fix Trade BV

Industry News: eightech air solder nis-20-82c electrical rating (14)

Seika Machinery Announces Two Major Product Introductions at APEX

Industry News | 2016-03-10 19:04:14.0

Seika Machinery will debut two additional new products at the 2016 IPC APEX EXPO. A new McDry Cabinet and Eightech reflow soldering system will be introduced at the show.

Seika Machinery, Inc.

ESSEMTEC to Display RO300FC-C at APEX 2008

Industry News | 2008-03-19 14:49:56.0

Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will showcase RO300FC-C full convection reflow oven with RO-CONTROL software in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

Technical Library: eightech air solder nis-20-82c electrical rating (117)

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: eightech air solder nis-20-82c electrical rating (3)

PCB cutting machine , PCB separator , PCB depaneling machine , pcb separator equipment

PCB cutting machine , PCB separator , PCB depaneling machine , pcb separator equipment

Videos

ASCEN PCB separator 620 model uses wedge cutter to shear PCB in line, internal stress decreases to lowest point, even the sensitive SMD modules or capacitance still won`t be influenced, then potential risk on quality is minimized. to avoid

ASCEN Technology

Ersa ETS-250

Ersa ETS-250

Videos

- Machine is available at any time, - Foam fluxer, - Single wave (laminar), - 3pcs of frame included, - Working condition. - YOM - 1995. It is filled with SN100C (106 kg) and we can provide report of test on the purity of the alloy. Equipmen

Solitech

Career Center - Resumes: eightech air solder nis-20-82c electrical rating (2)

Technical Specialist

Career Center | kemaman, malaysia Philippines | Maintenance,Production,Technical Support

• Conduct repairs and troubleshooting of production equipment to avoid / minimize production downtime. • Performs preventive maintenance of production equipment as defined in work procedure and according to their schedule of frequency. • C

Six Sigma Practitioner , Process Engineer

Career Center | Senai, Johor Malaysia | Engineering,Production,Quality Control

A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.

Express Newsletter: eightech air solder nis-20-82c electrical rating (942)

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

the defect rate of the measured machine. For exampl

SMT Express, Volume 5, Issue No. 3 - from SMTnet.com

SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1             Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1


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