Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Product introduction: Streamline shape design make the oven looks great,PLC+PID closed loop control to achieve high prectise temperature control and repeatable profilies. It can save 50 groups temperature parameters and provide extra 2 ports for
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Thu May 26 21:04:04 EDT 2005 | thaqalain
What is electrical clearance?
Used SMT Equipment | Soldering - Reflow
Production Overview:The 1505 MK5 from Heller Industries Inc is a Reflow Soldering Equipment with Heating Zone Length 200 mm. More details for 1505 MK5 can be seen below. With its features increases productivity, this 5 zone reflow oven improves quali
Used SMT Equipment | Soldering - Reflow
Production Overview: The 1700 reflow soldering oven models support high mix / medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precis
Industry News | 2018-04-15 20:01:15.0
SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2024-04-15 10:54:59.0
IPC J-STD-001 and IPC-A-610 cover printed board assembly process controls, materials, and post-assembly acceptance criteria for the electronics industry
Parts & Supplies | Assembly Accessories
Model: FUJI XP242 QP242 341 Specification: 12MM Electric Feeder Press Cover Material number: KDBC 0133 Name: Electric Feida Pressure Cover A large number of FUJI patch machines are sold for clearance of pressure covers: 2MDLFA 033900
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Parts & Supplies | Pick and Place/Feeders
MCA0051 FUJI CP6 8X4 Feeder Beak Model: Fuji FUJI Mounter Specifications: CP6 8X4 FEEDER Part Number: MCA0051 Name: CP6 8X4 FEEDER A large number of FUJI placement machines feeder press cover clearance prices for sale: 2MDLFA033900 FUJI NXTIII
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Career Center | Lancaster, Pennsylvania USA | Engineering
Provide leadership to the engineering staff and manage, initiation and completion of all engineering deliverables. Deal with customers, business associates, program managers, manufacturing, planning, marketing and purchasing. Requires extensive kno
Career Center | Charleston, South Carolina USA | Engineering,Maintenance,Production,Quality Control,Technical Support
UEC serves the aerospace, military, industrial, and commercial markets by providing comprehensive product design, system integration, and vertically integrated manufacturing solutions including: hardware, software, and mechanical engineering; rapid
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipc2221-2222-and-throughhole-pad-stacks_topic2586.xml
. Ideally, the plane anti-pad would be smaller than the padsize + the electrical clearance. The electrical clearance is the trace to padspacing rule
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Per the IPC-A-610 , a PCB with more than 5 solder balls (<=0.13mm) within 600mm² is defective, as a diameter larger than 0.13mm violates the minimum electrical clearance principle
