Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Distributor / Manufacturer
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
New Equipment | Rework & Repair Equipment
Inspection Mirror (SH-133S) The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
Electronics Forum | Thu Jul 27 14:35:12 EDT 2006 | rogerw_tech
I need some information about electrical test done on the pcb how does it work and what is the process?
Electronics Forum | Thu Jul 27 16:06:18 EDT 2006 | chrisgriffin
You will have to be more specific about your boards and process to get any help. There are many different types of in circuit tests and functional tests throughout the manufacturing process. The nature of these tests depend on board function. Sinc
Used SMT Equipment | Pick and Place/Feeders
Features: S/W: 2.8.1f Dual Vision Camera Agilis Capable Electrical Two-Pole Test Electrical Transistor Test Optical Centering Z High Speed (Midas Head) Autoteach Linescan for Z Hydra Condition: Complete & Operational
Used SMT Equipment | Pick and Place/Feeders
Software: 2.9.x T3 Linear Table Electrical Two-Pole Test Electrical Transistor Test Optical Centering Conveyor Shared Databases Hydra Z High Speed Hydra High Speed Autoteach Linescan for Z Line Mode Fast Place Sequence
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Parts & Supplies | SMT Equipment
DEK thimble(107785/112069) DEK thimble(107785/112069) Description: DEK thimble TOOLING PIN, MAGNETIC, 81mm, STD DIA. Part NO.: 107785/112069. 81mm 42.6mm. if need more info about the products , pls don’t hesitate to contact with us at an
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Events Calendar | Mon Jan 14 00:00:00 EST 2019 - Mon Jan 14 00:00:00 EST 2019 | ,
Webinar: Crimp Inspection, Quality Control in the Real World of Manufacture
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | West Melbourne, Florida USA | Production
Provide technical support in all areas of manufacturing in support of in-circuit and functional test. Debug printed circuit boards and product level assemblies to the component level. Work from test procedures, electrical schematics, technical note
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
Career Center | Laguna, Calabarzon Philippines | Engineering,Maintenance,Production,Technical Support
Base on my experience more on line sustaining and preventive maintenance in equipment and testing machine for electronics and semicon company Some slight skills in surface grinding,soldering and LAN connection and installation. Can submit report
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/industries/electrical
Electrical | Nordson YESTECH OPTICAL Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Automated Optical Inspection Conformal Coat Inspection Solder Paste Inspection Solutions PCB Assembly Aerospace Automotive Medical
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/electrical-type_topic661.html
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