Partner Websites: electroless and nickel and conductivity (Page 1 of 2)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

BGA288 19x19 mm 1.0 mm A-CABGA288- .8mm-19mm- DC Test Vehicle The test board was 2.18mm (86 mil) thick with 14 dummy inner layers. The board was constructed using FR-4 material in accordance with IPC-4101/126 with an electroless nickel/immersion gold (ENIG

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

BGA288 19x19 mm 1.0 mm A-CABGA288- .8mm-19mm- DC Test Vehicle The test board was 2.18mm (86 mil) thick with 14 dummy inner layers. The board was constructed using FR-4 material in accordance with IPC-4101/126 with an electroless nickel/immersion gold (ENIG

Heller Industries Inc.

What Is a Printed Circuit Board and What Do You Use One For?

Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-printed-circuit-board-use-for/

. They’re made of layers of materials, including tin-lead, nickel, and gold. They have to have high conductivity to keep the system working well

Imagineering, Inc.

Heat Treatments

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/heat-treatments

. The advantages of electroless over electro nickel are: (1) Uniform in thickness, even in deep recesses; (2) Non-porous; (3) Some ability to obtain higher hardness by baking; and (4) Better adhesion

ASYMTEK Products | Nordson Electronics Solutions

Everything You Need to Know About PCB Finish | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/

. Cost In the world of printed circuit boards, you get what you pay for. Generally, the more expensive PCB finishes like electrolytic wire bondable gold, electrolytic hard gold, and electroless nickel electroless palladium immersion gold (ENEPIG

Imagineering, Inc.

EC-2000 Series Conductive Silicones

ORION Industries | http://orionindustries.com/pdfs/Electrically_conductive_poron.pdf

* HB HB HB HB Vertical V-1 V-1 * V-1 Volume Resistivity, Ohm-cm (expression of conductivity) Rogers Corporation Internal Shielding Effectiveness, dB: At Thickness

ORION Industries

Understanding the PCB Fabrication Process: From Design to Delivery

Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/

. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options

Imagineering, Inc.

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

-Copper Lead-Free Solders and Nickel" 2001: Mark Norris, ViTechnology, LLC, Switzerland "Advances in Automatic Optical Inspection: Gray Scale Correlation vs. Vectoral Imaging" 2000: Kiyoshi Hasegawa, Akio Takahashi, Dr. Takaaki Noudou, Sumiko Nakajima

Surface Mount Technology Association (SMTA)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU “die to lid/heat spreader” (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses

Heller Industries Inc.

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

al. Abstract 17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract 17-2 ELECTROCHEMICAL MIGRATION ON HASL

Surface Mount Technology Association (SMTA)

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