New SMT Equipment: electromigration (2)

Reliability Testing Services

Reliability Testing Services

New Equipment | Test Services

Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution

ACI Technologies, Inc.

AutoCAF2

AutoCAF2

New Equipment | Test Equipment

AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper

Gen3 Systems

Electronics Forum: electromigration (53)

Electrical failures

Electronics Forum | Mon Feb 25 22:04:30 EST 2008 | davef

Here�s background on: * Electromigration: http://en.wikipedia.org/wiki/Electromigration * Dendrite: http://en.wikipedia.org/wiki/Dendrite_(crystal) For us, electromigration is the electrochemical process that creates dendrites. As a bonus, here's

SMT adhesive suggestions?

Electronics Forum | Fri Jul 20 12:28:47 EDT 2007 | dwanzek

Good luck. Loctite will work just fine if other combinations of variables do not allow voiding or electromigration.

Used SMT Equipment: electromigration (3)

Keithley AR178238-50

Used SMT Equipment | In-Circuit Testers

Keithley 238 Keithley 238 High-Current Source-Measure Unit Key Features and Benefits:     Four instruments in one (voltage source, voltage measure, current source, current measure)     10fA, 10μV measurement sensitivity     1A source and me

Test Equipment Connection

Keithley 238

Keithley 238

Used SMT Equipment | General Purpose Test & Measurement

Key Features and Benefits:     Four instruments in one (voltage source, voltage measure, current source, current measure)     10fA, 10μV measurement sensitivity     1A source and measure     Standard and custom sweep capability including pulse

Test Equipment Connection

Industry News: electromigration (36)

SMTA International Conference on Soldering and Reliability Call For Papers

Industry News | 2008-12-15 16:20:40.0

Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.

Surface Mount Technology Association (SMTA)

SMTA International Conference on Soldering and Reliability Call for Papers

Industry News | 2010-01-17 22:24:09.0

Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

Technical Library: electromigration (30)

Design of Experimentation for Affordability

Technical Library | 2019-07-11 11:07:08.0

Affordability is not exactly the primary word which comes to mind when discussing the use of design of experiments (DOE) principles, but is generally accepted as a necessary part of the engineering activities required in the development of a product or process. However, a number of studies have indicated that the cost savings derived from a well deliberated experimental design can be substantial in the initial stages where the conditions or parameters of a process are determined. Some studies have shown a greater than 50% cost savings compared to the more conventional means of trial and error approaches to process development. At ACI Technologies (ACI), we have found the use of DOE techniques fundamental in eliminating extraneous costs otherwise spent on unnecessary testing.

ACI Technologies, Inc.

The Quality and Reliability of Intel's Quarter Micron Process

Technical Library | 1999-05-07 08:48:52.0

This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability...

Intel Corporation

Videos: electromigration (1)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Events Calendar: electromigration (1)

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Events Calendar | Tue Feb 10 13:00:00 EST 2015 - Tue Feb 10 14:30:00 EST 2015 | ,

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Surface Mount Technology Association (SMTA)

Express Newsletter: electromigration (3)

SMTnet Express June 13 - 2013, Subscribers: 26140

SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging

Partner Websites: electromigration (12)

Call for Participation: Technical Paper - IPC APEX EXPO 2021

| https://ipcapexexpo.org/education/call-for-technical-paper-form

) Surface Reliability: sub-topics Corrosion Electromigration Objective Evidence Surface Insulation Resistance Testing (SIR) Other Topic Brief Biography

Advantages and Disadvantages of Different Surface Treatments of PCB

| https://www.nextpcb.com/blog/advantages-and-disadvantages-of-different-surface-treatments-of-pcb

). --> Easily occur electromigration and the occurrence of Giovanni bite in the copper under the solder mask. -->Electric measurement is also a problem 4. Chemical tin


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