Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper
Electronics Forum | Mon Feb 25 22:04:30 EST 2008 | davef
Here�s background on: * Electromigration: http://en.wikipedia.org/wiki/Electromigration * Dendrite: http://en.wikipedia.org/wiki/Dendrite_(crystal) For us, electromigration is the electrochemical process that creates dendrites. As a bonus, here's
Keithley 238 Keithley 238 High-Current Source-Measure Unit Key Features and Benefits: Four instruments in one (voltage source, voltage measure, current source, current measure) 10fA, 10μV measurement sensitivity 1A source and me
Key Features and Benefits: Four instruments in one (voltage source, voltage measure, current source, current measure) 10fA, 10μV measurement sensitivity 1A source and measure Standard and custom sweep capability including pulse
Industry News | 2008-12-15 16:20:40.0
Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.
Industry News | 2010-01-17 22:24:09.0
Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto, Ontario, Canada.
Technical Library | 2019-07-11 11:07:08.0
Affordability is not exactly the primary word which comes to mind when discussing the use of design of experiments (DOE) principles, but is generally accepted as a necessary part of the engineering activities required in the development of a product or process. However, a number of studies have indicated that the cost savings derived from a well deliberated experimental design can be substantial in the initial stages where the conditions or parameters of a process are determined. Some studies have shown a greater than 50% cost savings compared to the more conventional means of trial and error approaches to process development. At ACI Technologies (ACI), we have found the use of DOE techniques fundamental in eliminating extraneous costs otherwise spent on unnecessary testing.
Technical Library | 1999-05-07 08:48:52.0
This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability...
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Tue Feb 10 13:00:00 EST 2015 - Tue Feb 10 14:30:00 EST 2015 | ,
SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
) Surface Reliability: sub-topics Corrosion Electromigration Objective Evidence Surface Insulation Resistance Testing (SIR) Other Topic Brief Biography
). --> Easily occur electromigration and the occurrence of Giovanni bite in the copper under the solder mask. -->Electric measurement is also a problem 4. Chemical tin