Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
New Equipment | Test Equipment
AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper
Electronics Forum | Mon Feb 25 22:04:30 EST 2008 | davef
Here�s background on: * Electromigration: http://en.wikipedia.org/wiki/Electromigration * Dendrite: http://en.wikipedia.org/wiki/Dendrite_(crystal) For us, electromigration is the electrochemical process that creates dendrites. As a bonus, here's
Electronics Forum | Fri Jul 20 12:28:47 EDT 2007 | dwanzek
Good luck. Loctite will work just fine if other combinations of variables do not allow voiding or electromigration.
Used SMT Equipment | In-Circuit Testers
Keithley 238 Keithley 238 High-Current Source-Measure Unit Key Features and Benefits: Four instruments in one (voltage source, voltage measure, current source, current measure) 10fA, 10μV measurement sensitivity 1A source and me
Used SMT Equipment | General Purpose Test & Measurement
Key Features and Benefits: Four instruments in one (voltage source, voltage measure, current source, current measure) 10fA, 10μV measurement sensitivity 1A source and measure Standard and custom sweep capability including pulse
Industry News | 2008-12-15 16:20:40.0
Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.
Industry News | 2010-01-17 22:24:09.0
Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto, Ontario, Canada.
Technical Library | 1999-05-07 08:48:52.0
This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability...
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
| https://ipcapexexpo.org/education/call-for-technical-paper-form
) Surface Reliability: sub-topics Corrosion Electromigration Objective Evidence Surface Insulation Resistance Testing (SIR) Other Topic Brief Biography
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Additionally, thermally activated diffusion, electromigration, and environmental reactions degrade the semiconductor. Finally, as transistors shrink, they become more sensitive to high temperatures because of increased non- fatal manufacturing defects [1
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