Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
New Equipment | Test Equipment
AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper
Electronics Forum | Wed Jun 30 18:12:59 EDT 2004 | crios
Thanks for the information. davef, I will search for and review the Ion Chromatography for Ionic Cleanliness test method. This definitely is the test I want to perform. Do you know what the IPC specification is using this test method? The outside
Electronics Forum | Thu Jul 01 10:24:31 EDT 2004 | davef
There is no specification for �Ion Chromatography for Ionic Cleanliness�. The performance of your product in your customer use environment determines the level that you select. The good part for you is that have at least one pole that you can put i
Industry News | 2010-02-23 16:29:14.0
The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.
Industry News | 2010-10-04 16:59:29.0
The Balver Zinn Group announces that Gerjan Diepstraten will present a paper titled "Clean 'No-Clean' or Use a Water Wash Solder Paste?" at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Mike Bixenman, DBA, KYZEN Corporation " BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes " 2015
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Additionally, thermally activated diffusion, electromigration, and environmental reactions degrade the semiconductor. Finally, as transistors shrink, they become more sensitive to high temperatures because of increased non- fatal manufacturing defects [1