New SMT Equipment: electromigration method 210 (635)

Reliability Testing Services

Reliability Testing Services

New Equipment | Test Services

Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution

ACI Technologies, Inc.

GE IS210AEAAH1B

GE IS210AEAAH1B

New Equipment | Industrial Automation

Contact us anytime Email: sales6@cambia.cn Mobile: +86 13599507613 Cambia Automation Limited is a reliable supplier for module, cards, boards, processor in China.        We believe that getting start is very difficult and then it gets better.

Cambia Automation Limited

Electronics Forum: electromigration method 210 (22)

Electromigration Testing

Electronics Forum | Wed Jun 30 18:12:59 EDT 2004 | crios

Thanks for the information. davef, I will search for and review the Ion Chromatography for Ionic Cleanliness test method. This definitely is the test I want to perform. Do you know what the IPC specification is using this test method? The outside

Electromigration Test

Electronics Forum | Wed May 12 11:02:00 EDT 2010 | eugene123

Hope every one are in good condition. I am Eugene, QA Engineer from Singapore, I been assigned to perform a electromigration test for the test coupon that consist 96 test point. Test condition: 85 deg C, 88% RH and 50V DC Measure Condition: 100V DC a

Used SMT Equipment: electromigration method 210 (1)

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Used SMT Equipment | Turnkey Lines

Functional Pre-Owned Complete SMT Assembly Line - Still Operational    (Subject to prior sell, I am listing this on other venues)   Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe

CybrSecurity Corporation

Industry News: electromigration method 210 (14)

Microtronic Announces New Online Resource for LBT-210 Solderability Tester

Industry News | 2013-07-14 08:51:42.0

Microtronic GmbH announces the launch of its new product home page for the LBT-210 Solderability Tester.

Microtronic GmbH

See the Revolutionary Solderability Tester from Microtronic at productronica

Industry News | 2013-11-04 14:13:34.0

Microtronic GmbH announces that it will showcase its LBT-210 Solderability Tester in the LICO Stand #481, Hall A4 at the productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Microtronic GmbH

Technical Library: electromigration method 210 (72)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

SMT Stencil Design And Consideration Base on IPC

Technical Library | 2010-03-23 11:50:22.0

This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology

Association Connecting Electronics Industries (IPC)

Videos: electromigration method 210 (35)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

SMT LED Assembly Line Multi Magazine PCB NG/OK Unloader

SMT LED Assembly Line Multi Magazine PCB NG/OK Unloader

Videos

PCB magazine unloader and Multi Magazine PCB NG/OK Unloader is used to receive SMT circuit board in DIP production line,After AOI machine, receive the signal given by AOI, If you want know more solution for the SMT manufacturing line, please go an

ASCEN Technology

Express Newsletter: electromigration method 210 (356)

SMTnet Express June 13 - 2013, Subscribers: 26140

SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging

Partner Websites: electromigration method 210 (67)


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Easily dispense fine pitch components with ±25µm positioning accuracy.
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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.