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- Application Note 202 Acoustic solid left, optical image of PGBA middle, diagram right. Sample & Method Zip-Slice software was first used to scan this plastic-packaged Ball Grid Array (PBGA
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) Inspection Methods Microvia Interface Failures Process Control Reliability after Repair or Rework Surface Reliability Test Method Developments Tin Whiskers Other… Enter other
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#210 to learn about the latest developments in Bond and Materials Testing including the new Prospector™. Dage - Celestica Case Study Nordson DAGE Nordson DAGE Awarded a Global Technology Award for Camera Assist Automatic Bondtesting at SMTA International Nordson DAGE Second Award for this Core
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#210 to learn about the latest developments in Bond and Materials Testing including the new Prospector™. Nordson DAGE Awarded a Global Technology Award for Camera Assist Automatic Bondtesting at SMTA International Nordson DAGE Second Award for this Core Application Cold Bump Pull Nordson DAGE Nordson
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#210 to learn about the latest developments in Bond and Materials Testing including the new Prospector™. Electronics - Semiconductor Nordson DAGE The Nordson DAGE XM8000 fully automatic wafer inspection system provides a unique solution for inspecting bumps, TSVs, MEMs and other structures on 200, 300 and 450 mm wafers
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2019 Nordson DAGE Visit us in Booth #210 to learn about the latest developments in Bond and Materials Testing including the new Prospector
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). Surface-mount technology has been the primary device attachment method for a wide variety of… Battery BondTesting blind spot Nordson DAGE Dual Win for Nordson DAGE Camera Assist Automatic Bondtesting at Nepcon China 2015 Nordson DAGE Fourth Award for this application 4600-LF Automated Lead
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) are electrical components that are soldered to printed circuit boards (PCB). Surface-mount technology has been the primary device attachment method for a wide variety of
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Solutions introduces new Helios® system for dispensing single-component thermal interface materials Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste 13 Apr 2022
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) Automated X-ray Inspection (AXI) Failure Analysis In-circuit Testing (ICT) Inspection Methods Microvia Interface Failures Process Control Reliability after Repair or Rework Surface Reliability Corrosion Electromigration Objective Evidence Surface Insulation Resistance Testing (SIR
