Industry Directory | Consultant / Service Provider / Manufacturer
EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
New Equipment | Test Equipment
AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper
Electronics Forum | Wed Jun 30 18:12:59 EDT 2004 | crios
Thanks for the information. davef, I will search for and review the Ion Chromatography for Ionic Cleanliness test method. This definitely is the test I want to perform. Do you know what the IPC specification is using this test method? The outside
Electronics Forum | Wed May 12 11:02:00 EDT 2010 | eugene123
Hope every one are in good condition. I am Eugene, QA Engineer from Singapore, I been assigned to perform a electromigration test for the test coupon that consist 96 test point. Test condition: 85 deg C, 88% RH and 50V DC Measure Condition: 100V DC a
Industry News | 2010-02-23 16:29:14.0
The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.
Industry News | 2010-10-04 16:59:29.0
The Balver Zinn Group announces that Gerjan Diepstraten will present a paper titled "Clean 'No-Clean' or Use a Water Wash Solder Paste?" at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ ITEM NO.:JW-214NA ORDER(MOQ):1 PAYMENT:T/T PRODUCT ORIGIN:USA COLOR:Brand new SHIPPING PORT:Xiamen
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
SMTnet Express, August 8, 2019, Subscribers: 32,214, Companies: 10,853, Users: 25,321 Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat Credits: Alpha Assembly Solutions The requirement
| https://ipcapexexpo.org/education/call-for-technical-paper-form
) Inspection Methods Microvia Interface Failures Process Control Reliability after Repair or Rework Surface Reliability Test Method Developments Tin Whiskers Other… Enter other
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Mike Bixenman, DBA, KYZEN Corporation " BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes " 2015
