Industry Directory | Manufacturer
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Electronics Forum | Tue May 05 07:04:25 EDT 2015 | anirudh_thabjul
Hi Everyone, I have done with my PCB Prototyping. I want to send my Bare Board for Components assembly. So, I need to order the respective components for my assembly. Can anyone suggust me a good electronic distributor in France or Europe. Re
Electronics Forum | Tue May 05 08:26:42 EDT 2015 | anirudh_thabjul
Thankyou for your reply dude. I need to buy components for small volume production. I searched the sites you refered to me but they are USA based Electronic distributors and they are charging a lot of money for only shipping. So, Do you know any
Used SMT Equipment | Flexible Mounters
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-1 JUKI chip mounter Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laser identification chip ~20mm componen
Industry News | 2013-03-12 11:34:11.0
GPD Global has appointed Technical Resources Corporation (TRC) as its representative in Florida, Puerto Rico and the Caribbean.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Parts & Supplies | Pick and Place/Feeders
product description ： Panasonic KME Panasert SMT Component Feeder . part name: M9 Type Feeder. P/N: M9E3CVM0000 specification:24x12mm Emboss Tape Feeder 3P Large Reel. Used for :Panasonic KME Panasert CM120-MU CM20F-M CM201 CM202 CM301 Electronic Com
Parts & Supplies | Pick and Place/Feeders
W56Motor feeder Feature : FUJI SMD SMT Component Power Motor Feeder. Part Name: Motor Feeder W56 56mm. Part Number: FMB-56E-380 AKDHA6100 KDE-5600. For FUJI IP1 IP2 IP3 QP242E QP3 XP2 Electronics Assembly Equipment. Brand : FUJI Unit : PC(s) I
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Mar 24 00:00:00 EDT 2021 - Wed Mar 24 00:00:00 EDT 2021 | ,
Arizona/Sonora Chapter Meeting: Electronic Component Market Update
Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA
IPC SummerCom
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Cixi, Alabama China | Production,Sales/Marketing,Technical Support
Specialized in producing and dealing with the electronic components, such as Network products, ISDN Products, GAS Tube arrester, LAN connectors, Telecommunication and so on. If you are interested in our products, please contact us without any hesitat
Career Center | Sullivan, Ohio USA | Engineering,Maintenance,Production,Quality Control,Sales/Marketing,Technical Support
PROFESSIONAL EXPERIENCE Manufacturing Engineer August 1991 - January 2014 * Read blueprints, wiring diagrams, schematic drawings, or engineering instructions for assembling electronics units, applying knowledge of electronic theory and component
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
it was clear. An SMD component was placed on the surface o
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/electronics-assembly-and-packaging?page=2
Nordson precision application solutions for electronic and electrical component manufacturing | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/instructor-component-series/
: Upon successfully completing this learning activity, instructors will demonstrate the ability to: Identify selected component package styles List common layout designators Quantify selected electronic components using standard color code Identify polarity/orientation markings Conduct group
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, China
Phone: +86-138-29839112
