Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_reflow_ovens_electrovert.html
SMT & PCB Equipment, Reflow Ovens, Electrovert OmniFlow 14 Reflow Oven Electrovert OmniFlow 14 Relow Oven Left to Right Edge Rail and Mesh Rail Heat Option Independent High Temp Safety Circuit Inert Heating Module Integrated Oxygen Analyzer Quick Purge Auto Chain Oilers
