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The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6

Heller Industries Inc.

SMT & PCB Equipment, Reflow Ovens, Electrovert OmniFlow 14 Reflow Oven

1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_reflow_ovens_electrovert.html

SMT & PCB Equipment, Reflow Ovens, Electrovert OmniFlow 14 Reflow Oven   Electrovert OmniFlow 14 Relow Oven Left to Right Edge Rail and Mesh Rail Heat Option Independent High Temp Safety Circuit Inert Heating Module Integrated Oxygen Analyzer Quick Purge Auto Chain Oilers

1st Place Machinery Inc.


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