#Module Thyristor Type:Snubberless Peak Repetitive Off-State Voltage Vdrm:600V On State RMS Current, IT(rms):12A Gate Trigger Current (QI), Igt:35mA Gate Trigger Current Max, Igt:35mA - Global Electronic Components Distributor Supply of electronic
Layers 2-64L Plate Thiickness 0.6-10mm Minimum mechanical aperture 0.2mm Minimum laser aperture 4mil HDI Type 1+n+1、2+n+2、3+n+3 Minimum line width & spacing 4/4mil
Industry News | 2011-09-06 12:57:28.0
The SMTA announced that the Evolving Technologies Summit will be held on October 17, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The purpose of the summit is to present the key issues in packaging, SMT, LED, Solar and printed electronics in order to gain insight about the way technology will change in the future.
Industry News | 2010-08-02 12:49:43.0
The SMTA is pleased to announce four symposia to be featured at SMTA International: the Evolving Technologies Summit, AIMS Harsh Environments Symposium, Contract Manufacturing Symposium, and Lead-Free Soldering Technology Symposium. SMTAI will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, FL on October 24-28, 2010. All symposia feature paper sessions organized by industry experts, and are included with either a VIP or Technical Conference registration.
JUKI HA005530010 SWITCH(BEZEL) www.fujintai.com JUKI HA005530020 SWITCH(LENS WHITE) FUJINTAI TECHNOLOGY CO.,LTD JUKI HA00553002A SWITCH www.fujintai.com JUKI HA00553002B SWITCH FUJINTAI TECHNOLOGY CO.,LTD JUKI HA00553002C SWITCH www.fujintai.
JUKI HA004360000 SWITCH www.fujintai.com JUKI HA004470000 PROTECTOR 5A FUJINTAI TECHNOLOGY CO.,LTD JUKI HA004540000 SWITCH www.fujintai.com JUKI HA004540020 SWITCH OPERATION FUJINTAI TECHNOLOGY CO.,LTD JUKI HA00454002A SWITCH OPERATION www.fu
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2019-06-05 11:11:06.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
Career Center | Muzzaffarnagar, India | Production
Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht
SMTnet Express, January 9, 2014, Subscribers: 26467, Members: Companies: 13548, Users: 35610 Embedded Passive Technology by Hikmat Chammas; Honeywell International Embedded Passive Technology is a viable technology that has been reliably used
. The resistance value is proportional to the signal frequency and inversely proportional to the PCB trace width. In embedded systems, when the signal is greater than 20M and the PCB trace length is greater than 5cm, the system adds serial matching resistors
. Microelectronics - Bonded Wafer Microelectronics - Chip Capacitor Microelectronics - Chip Scale Package Microelectronics - Flip Chip Microelectronics - Hybrid/MCM/SIP Microelectronics - IGBT Power