Industry Directory | Manufacturer
Integran makes nanocrystalline nickel SMT solder stencil blanks that are subsequently laser cut into the high durability and very precise stencils. We make 500-1000 a month of 22.5" x 24" foils.
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
Gold embrittlement of solder joints has been a concern for many decades. SEM Lab, Inc. supports evaluation for this condition. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. https://s
Electronics Forum | Thu Nov 11 17:49:54 EST 1999 | Jeff_Tamagi
Do I have to tin gold lead devices? Can I use indium? Can I use lead-free Can I use tin-free
Electronics Forum | Fri Nov 12 16:59:58 EST 1999 | John Thorup
Hi Michael While driving home last night I realized the omission in my response. I thought someone would call me on it. I should have clarified that the dissolution of the gold into the joint would be affected by the thickness of the gold plating,
Industry News | 2016-11-30 14:47:45.0
ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx
Industry News | 2013-08-01 13:16:42.0
The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX.
Parts & Supplies | ESD Control Supplies
10s 10) Tensile strength: 3.6Mpa 11) Fracture elongation: 188% 12) Tear elongation: 20.6KN/m 13) Rebound elasticity: 14% 14) Impact embrittlement temperature: No damage at -25℃ 15) Permanent compression change rate, 70℃*22h, compression 25%: 17
Technical Library | 2007-04-18 19:23:22.0
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service.
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
| https://metalsqueegees.com/collections/smt-squeegee-blades/products/smt-squeegee-blade-40mm-wide-with-holes-for-hit
. * Note: the life of the blade may be shorter with this option due to increased embrittlement at the bend region. No Yes Quantity is backordered
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/call_for_papers.cfm
: Tin whiskers Electromigration and corrosion Solder embrittlement Materials: Conformal and hydrophobic coatings Thermal interface materials Underfills and encapsulants Environmental compliance
