New SMT Equipment: emc etc reflow (d1) (158)

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

New Equipment | Assembly Services

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

Shenzhen ETA Technology Co., Ltd

Dual Lane SMT Reflow Oven KTR-1000D

Dual Lane SMT Reflow Oven KTR-1000D

New Equipment | Reflow

Dual Lane SMT Reflow Oven KTR-1000D Nitrogen soldering process dual rail conveyor Weight Appx.:306​0Kg Dimension 6300*1680*1530mm Product description: 10 zones Dual Lane SMT Reflow Oven KTR-1000D 10 zones Dual Lane SMT Reflow Oven KTR-1000D

Kait High Tech Co.,ltd

Electronics Forum: emc etc reflow (d1) (1)

What pressure is recommended to clean AMT boards after reflow

Electronics Forum | Fri Sep 07 15:19:42 EDT 2001 | davef

Watt tiepoo? [Cereally, you can usually fix typos after you post by using the P yellow �edit� button that shows when you are looking at your posting.] We�re had people on SMTnet that were washing their boards with a brush attached to the end of a ga

Used SMT Equipment: emc etc reflow (d1) (5)

Panasonic BM231

Panasonic BM231

Used SMT Equipment | SMD Placement Machines

  ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand: CP40L; CP40LV; CP45F; CP45FV;  CP45FVneo); YAMAHA SMT mac

Shenzhen ETA Technology Co., Ltd

Yamaha Ys12

Yamaha Ys12

Used SMT Equipment | Chipshooters / Chip Mounters

  ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand: CP40L; CP40LV; CP45F; CP45FV;  CP45FVneo); YAMAHA SMT mac

Shenzhen ETA Technology Co., Ltd

Industry News: emc etc reflow (d1) (3)

Essential PCB Design Rules

Industry News | 2018-10-18 11:20:59.0

Essential PCB Design Rules

Flason Electronic Co.,limited

Top 10 Consumer Electronics Companies in the World

Industry News | 2018-12-08 03:35:10.0

Top 10 Consumer Electronics Companies in the World

Flason Electronic Co.,limited

Technical Library: emc etc reflow (d1) (8)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods.

Technical Library | 2010-03-18 14:02:03.0

Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.

Trace Laboratories

Career Center - Resumes: emc etc reflow (d1) (1)

Field Service Engineer / Manufacturing Engineer

Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support

• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R

Express Newsletter: emc etc reflow (d1) (844)

Laser Solder Reflow: A Process Solution, Part 2

Laser Solder Reflow: A Process Solution, Part 2 Laser Solder Reflow: A Process Solution, Part II EFD, Inc Credit/Source: John Vivari - EFD, Inc. Alex Kasman - LEISTER Technologies LLC EFD Inc. and Leister USA have collaborated to bust

Partner Websites: emc etc reflow (d1) (5)

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

Cost of Gold, Copper, Palladium, Silver, tin etc Protective coatings and effects of soldering operations Solderability reflow wetting patterns Solderability tests:                 Dip and inspect, wetting balance, rotary dip test                 Simple

Surface Mount Technology Association (SMTA)


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