Industry Directory | Manufacturer
Advanced Electronic Materials. Adhesives, encapsulants and coatings.
High temperature adhesives, ceramics, epoxies, conductive adhesives, sealants, encapsulants, insulation products, specialty materials, etc.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Electronics Forum | Tue Aug 26 17:50:52 EDT 2014 | dkrawchuk
Hi, We have some boards that we apply an underfill to a BGA. Some boards have underfill that covered the surrounding passives. The customer is concerned that the different expansion rates will damage the passives. Does anyone know of a company th
Electronics Forum | Mon Aug 19 13:32:54 EDT 2019 | aqueous
ROSE testing a post-reflow assembly which has been reflowed using no-clean flux may not yield information that is helpful. No-clean flux technology works by encapsulating the flux's activators and other chemical constitutes that would be harmful if l
Used SMT Equipment | Coating and Encapsulation
NORDSON ASYMTEK automated fluid dispenser Model: SL-940E Produced: 01/2015 Working flow Right to Left Equipment have two dispensing head Film coating head and precise dispensing head
Used SMT Equipment | Coating and Encapsulation
O/S: Windows XP Details: • SC200 HS head • 100-120v, 208-240V • Single Phase • 50 / 60 HZ Location & Shipping: LCI FL / FOB origin
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Parts & Supplies | Coating and Encapsulation
Yamaha Assembleon Machine SMT Spare Parts K48-M3856-00X Environment Friendly Detailed Product Description Part Name: NSL Grease Part Number: K48-M3856-00X Yellow: Purple Weight: 80g Machine: Yamaha Environment: Clean Caution: NSL Grease
Parts & Supplies | Coating and Encapsulation
N610017657AB original new Holder For Panasonic NPM 2nozzle head unit (No Filter) N210030755AA Nozzle Holder N610113699AA NPM 16 head holder 010DC111260 CM202 HOLDER N610011241AB/N610075626AA Nozzle Holder NOZZLE HOLDER N61009409AA CM202
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | San Jose, California USA | Engineering,Technical Support
1.PC Board Design Engineer DRAM Memory Module, Flash product(Card, SSD, USB) design/Layout. Motherboard and flash controller experience is a plus. BSEE degree. 2.Mechanical Design Engineer Mechanical design, modeling for high volume plastic pa
Career Center | , | Engineering,Research and Development,Technical Support
For over 50 years, Emerson & Cuming has been designing and manufacturing high performance encapsulants, adhesives, and coatings for the automotive, telecommunications and electronic industries. Our expansive breadth of technologies combined with our
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-encapsulation-application.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Encapsulation Dispensing Encapsulation Dispensing, Dam and Fill, Glob Top Dam and Fill is a two-step process for fully encapsulating high I/O count, wire bonded die
| https://www.smtfactory.com/i-c-t-global-technical-support-for-automotive-electronics-europe-station.html
. These machines ensure accurate component placement, enabling high-quality PCB manufacturing. 2. PCBA Coating Line Machines PCBA coating line machines are crucial for coating and encapsulating electronic components
