Industry Directory | Manufacturer
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
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New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Our company has many products in stock,which are immediately available.The warranty is 1 years which apply to a
New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Our company has many products in stock,which are immediately available.The warranty is 1 years which apply to a
Electronics Forum | Mon Feb 14 21:01:15 EST 2000 | Thomas Ravener
IBM, Endicott, New York did extensive research on that. There was also some information I think that was published. You may want to contact Howard Manko of Manko & Associates. He's the soldering guru and has written many books on soldering & solderab
Electronics Forum | Thu Apr 29 09:02:02 EDT 1999 | Frank Boyko
| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. If anyone can it will be IBM. Call Voya Markovitch at 607-757-1335 (Endicott, NY). He is a technical
Industry News | 2003-01-31 08:23:54.0
To Compensate for Softer PCB Demand
Industry News | 2003-02-07 09:13:12.0
The Sessions Covered Current and Emerging Technologies
Technical Library | 2006-11-14 12:48:31.0
Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package
Technical Library | 2008-06-25 16:11:51.0
Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology.
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Endicott Interconnect Technologies Credit/Source: Michael J. Rowlands, Rabindra Das More and more
Surface Mount Technology Association (SMTA) | https://www.smta.org/directory/suppliers.html
CyberOptics Corporation Minneapolis, MN Datum Alloys Endicott DEKRA iST Reliability Services Inc. Hsinchu City, Taiwan DG Marketing Corporation Austin, TX Digitaltest, Inc. Concord, CA E.T.S. Group, Inc
