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SMT Express, Volume 5, Issue No. 2 - from

SMT Express, Volume 5, Issue No. 2 - from Volume 5, Issue No. 2 Wednesday, February 19, 2003 OnBoard Forum Who's OnBoard?Michael Sivigny Begins: Monday, March 3, 2003 8:00 AM ET Ends: Friday, March 7

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ACI Technologies, Inc

ACI Technologies, Inc. |

. The interaction between Peak Reflow Temperature and Surface Finish (Figure 2) also had a significant response. For this customer’s particular assembly, an electroless nickel immersion gold (ENIG

ACI Technologies, Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. |

. Figure 1 illustrates Aspandiar’s solder joint void classifications. Figure 1. Solder Joint Void Classifications [4] The following sections summarize published literature on the impact of voids in BGA solder joints found during the authors’ literature review. Study #1: D. Banks et al

Heller Industries Inc.

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