Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Manufacturer
PCB Global is a dedicated Prototype Quick Turn High Tech. PCB supplier - Quotes and orders can be processed 24/7/365 - free online quotation visit www.pcbglobal.com
Project Description | Parameters 6 Layer Thickness: 1.8+/-0.18 mm Min Hole Size: 0.25 mm Width/Space: 0.2mm/0.2 mm Surface Treatment: ENIG | Craft Gold Finger 5U" Thick Au | Application Telecommunication
FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Thu Jul 10 09:16:41 EDT 2008 | aj
Hi all, What should the typical gold thickness be on ENIG boards ? aj...
Industry News | 2017-07-19 21:09:38.0
STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
Parts & Supplies | Circuit Board Assembly Products
1). PCB prototypes to small volume. 2). Standard FR-4, 0.3-5mm thick, 1-5 oz 3). 1-30 Lalyer 4). MOQ 1 PCS 5). 4 days delivery 6). HASL, ENIG, OSP etc finish
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
Technical Library | 2023-01-06 16:09:03.0
The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad.
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_20_09.pdf
. Gold removal criterion was modified, it must be removed regardless of initial thickness, with the exception of ENIG boards Reflow soldering shall have a documented process with defined requirements
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
is D/δ for the case of diffusion control, were D is the diffusion coefficient in liquid and δ is the thickness of the effective concentration boundary layer. In general, the boundary layer thickness is less than 0.1mm. This boundary layer is a layer of
