Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Consultant / Service Provider
Manufacturer of non-contact 3D measurement systems based on low coherence interferometry technology. Products include optical profilometers, OCT systems, and metrology software.
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New Equipment | Solder Paste Stencils
DEK Horizon 03iX Fully Automatic Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK Horizon 03iX SMT Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type Hawkeye 750 or Hawkeye 1700 (optional) 198040 198043 hawkeye Board foil clamp siz
Industry News | 2016-06-19 19:44:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Parts & Supplies | Circuit Board Assembly Products
1). PCB prototypes to small volume. 2). Standard FR-4, 0.3-5mm thick, 1-5 oz 3). 1-30 Lalyer 4). MOQ 1 PCS 5). 4 days delivery 6). HASL, ENIG, OSP etc finish
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
Technical Library | 2009-07-22 18:33:41.0
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.
Technical Library | 2023-01-06 16:09:03.0
The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Career Center | Farrukh Hussain, Pakistan | Engineering,Maintenance
PLC, SCADA, designing circuit or PCB layout, troubleshooting and maintenance, electrical and instrumentation, electronics design, software skill with programming.
Career Center | Karachi, Pakistan | Engineering,Maintenance
PLC, SCADA, designing circuit or PCB layout, troubleshooting and maintenance, electrical and instrumentation, electronics design, software skill with programming.
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max
ORION Industries | http://orionindustries.com/pdfs/300lse.pdf
: Technical Data September, 2002 Tape 9453LE Tape 9471LE Tape 9472LE Adhesive: 3.6 mils (91 microns) 2.3 mils (58 microns) 5.2 mils (132 microns) (Solvent Free) 3M High-strength 3M High-strength 3M High-strength Acrylic Adhesive Acrylic Adhesive Acrylic Adhesive 300LSE 300LSE 300LSE Liner
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