Industry Directory | Manufacturer / Manufacturer's Representative
Mfg. Rep for PCBA & MicroElectronics assembly/rework/repair equipment & supplies. Territory is GA, AL, MS & TN.
Electronics Forum | Mon Aug 14 09:58:34 EDT 2006 | RLM
Check Epotek http://www.epotek.com Look in their General adhesive section. Epotek 600 is black if it will work for you.
Electronics Forum | Tue Nov 09 16:12:17 EST 2004 | davef
Thermally conductive epoxies are rarely used to hold components in-place. They are more likely used as fillers between two surfaces. Yes, single part glues without an activator are available that are suitable for screen printing or dispensing. Som
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/jets?con=t&page=6
meet the varied fluid dispensing needs of today’s manufacturers Products Content Your results for: Jet Dispensers Jetting LowViscosity TwoPart Epoxy EPOTEK 301 Nordson ASYMTEK (AHS-022, May 2007) Customer Success
