Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
YAMAHA YG200 is a high-speed SMD Surface Mounting machine, which has 4nos tables and totals 24 head nozzles, this machine mainly used for mount chip components, like 0201/0402/0603/0805/1206 or small QFN IC. “DONGGUAN KINGSUN AUTOMATION TECHNOLOGY
JUKI KE2070L High Speed Chip Shooter SMT Machine MC Model KE-2070 Board size M size (330×250mm) ○ L size (410×360mm) ○ L-Wide size(510×
Electronics Forum | Fri May 10 17:50:25 EDT 2002 | davef
We chart the following: * Reflow: Time over liquidous +25�C * Wave: Contact time and track tin, copper, gold, and antimony in pot analysis.
Electronics Forum | Wed Jan 15 11:42:57 EST 2003 | burb1999
we have recently been trying silver composition on our pads with our PCB boards. I am wondering what if any characteristics are different from tin etc... I have found with profiling the board it to be about the same temps. but getting granular looki
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Used SMT Equipment | SMD Placement Machines
ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand： CP40L; CP40LV; CP45F; CP45FV; CP45FVneo); YAMAHA SMT mac
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Parts & Supplies | Pick and Place/Feeders
CP45 Filter Part No:N454ZX11-049-001 Our company products fields : 1.used SMT machines , peripheral equipments and spare parts : SMT feeders, nozzles, belts, filters, motors, boards, Cylinders,Guides, Feeder parts etc... (Mainly parts brand
Parts & Supplies | SMT Equipment
SAMSUNG SMT MARGINAL RAY CP40LV VACUUM GENERATOR Our company products fields : 1.used SMT machines , peripheral equipments and spare parts : SMT feeders, nozzles, belts, filters, motors, boards, Cylinders,Guides, Feeder parts etc... (Mainly par
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
slim kic 2000 Specifications: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Sarasota, Florida | Production
Operation of SMT equipment including Screenprinters, Chipshooters, Component Mounters, Reflow Ovens, etc. Set-up new jobs. Inspection to IPC-A-610 Class 2. Competitive wages and excellent benefit package. Qualified candidates may apply via email
Career Center | Rancho Cucamonga, California USA | Production
The successful candidate will have at least one year experience and knowledge in Pick and Place programming for machines such as Fuji, Samsung, Panasonic, or Tyco; stencil printing and solder past knowledge; wave solder and wave solder washing proce
Career Center | Cavite, Philippines | Maintenance,Production,Technical Support
January 15- 2013 to Prsent :Maintenace Technician National Agriculture Development Company Haradh Project 2557 Riyadh 11461, Saudi Arabia Responsibilities 1. Daily checking of Electrical Panels 2. Install Main power for
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
KingFei SMT Tech | https://www.smtspare-parts.com/sale-34600903-blower-motor-for-reflow-oven-pkrk93s-2a-fuji-etc-reflow-motor-300w-2p.html
Blower Motor For Reflow Oven PKRK93S-2A FUJI ETC Reflow Motor 300W 2P Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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; DIP equipment: DIP insertion line, wave soldering machine , assembly line, belt line), test equipment, packaging equipment, etc. . ❙ Reflow Oven Video 文章From:http://www.etasmt.com/te_news_bulletin/2019-06-21/7161
