Technical Library: europlacer and finding and machine and zero (Page 1 of 1)

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Technical Library | 1999-08-05 10:57:54.0

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity.

SEMATECH

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

Technical Library | 2007-06-27 15:43:06.0

Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.

Universal Instruments Corporation

Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards

Technical Library | 2019-09-11 23:33:04.0

There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.

LPKF Laser & Electronics

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2007-03-08 19:31:10.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.

Henkel Electronic Materials

Design and Process Development for the Assembly of 01005 Passive Components

Technical Library | 2018-03-05 11:22:48.0

Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.

Sanmina-SCI

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