New Equipment | Industrial Automation
│Skype : dddemi33 │Sales Manager : Tiffany Guan │QQ :2851195473 │Whats@app : +86 18030235313 RFQ e-mail : plcsale@mooreplc.com General information： ∽port：XIAMEN ∽payment：T/T ∽lead time：3-5days ∽warranty ：12mont
New Equipment | Industrial Automation
│Skype : dddemi33 │Sales Manager : Tiffany Guan │QQ :2851195473 │Whats@app : +86 18030235313 RFQ e-mail : plcsale@mooreplc.com General information： ∽port：XIAMEN ∽payment：T/T ∽lead time：3-5days ∽warranty ：12mont
Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang
| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther
Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson
| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi
Industry News | 2010-04-23 18:53:17.0
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
Industry News | 2008-09-08 18:17:57.0
Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.
Parts & Supplies | Pick and Place/Feeders
CM402 / CM602 ·8mm KXFW1KS5A00 with sensor KXFW1KSBA00 without sensor ·12/16mm KXFW1KS6A00 with sensor KXFW1KSCA00 without sensor ·24/32mm KXFW1KS7A00 with sensor KXFW1KSDA00 without sensor ·44/56mm KXFW1KS8A00 with sensor
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, October 17, 2013, Subscribers: 26325, Members: Companies: 13458, Users: 35281 Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging by L.C. Tsao; National Pingtung University of Science
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/high-temp-soldering/
. The act of implementing HMP solder will require soldering temperatures that are higher than standard Sn/Pb eutectic solders. Manufacturers soldering at high temperatures need to be aware of a few simple rules to prevent catastrophic component or board failures
Heller Industries Inc. | https://hellerindustries.com/reflow-oven-1912exl
Used Reflow Oven For High Volume PCB Assembly - Heller Home » Used Reflow Oven For High Volume PCB Assembly Used 1912EXL Reflow Oven Reflow Oven Model: 1912EXL DOM
