Industry Directory | Manufacturer
DriSteem provides reliable and efficient humidity control, evaporative cooling, and water treatment solutions for commercial and industrial applications.
Utilise Gold contains an international business directory of suppliers of precious metal materials used in the electronics industry, including contacts, plating salts, pastes, solders, bonding wires and evaporation materials.
The DriSteem Adiatec ultrasonic humidifier provides evaporative cooling and humidification in room or in AHU/duct for application flexibility. Ultrasonic units humidify using high frequency oscillation of piezoelectric transducers, causing mist to de
The DriSteem Adiatec ultrasonic humidifier provides evaporative cooling and humidification in room or in AHU/duct for application flexibility. Ultrasonic units humidify using high frequency oscillation of piezoelectric transducers, causing mist to de
Electronics Forum | Thu Oct 21 09:48:37 EDT 1999 | Larry J
Is it possible for flux to evaporate out of the solder paste, and how long would it take? What kind of effect would this have on reflow if all the flux evaporated?
Used SMT Equipment | Other Equipment
EMC Evaporator IBE SMT Inventory ID : 151201-001 EMC Serial Number : 7809908 Vintage : Details • Model: 85ESS • 240 VAC 3-Phase 40 FLA 60Hz Click Here for more details or to request a quote online... IBE SMT Equipment 281-259-9660 Off
Used SMT Equipment | Board Cleaners
Tank Capacity: 85 gallons (322 liters) Heat: 12,000 watts total heat at 230 Volt, 3 Phase. Heaters are derated at lower voltages. Overall Dimensions: 38" x 48" x 40"H Shipping Weight: Approximately 600 lbs. Evaporation Rate: 4 - 6 gallo
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2019-10-02 16:32:48.0
Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2024-01-08 18:36:01.0
The following aims lie behind the investigations described: The circuit board is an integrated structure made of metal and plastic. Like most integrated components enclosed in plastic, it absorbs water. When it is rapidly heated as, for example, in soldering technology temperature processes, it is a well known fact that the water will evaporate abruptly, leading to destruction. It is therefore essential that the circuit board be dried before these soldering processes. Circuit board manufacturers are extremely hesitant at providing instructions on drying their circuit boards. Information from the ZVEI [1] should also be regarded critically. The cardinal problem is the high temperature which is recommended for baking. If this is applied, the result is often de-lamination and distortion of the circuit boards. Corrosion and the formation of intermetallic phases of the metallic surfaces are also to be expected. The following investigates whether gentle drying at 45°C or 60°C and at low relative humidity achieves the same result as baking at high temperatures. The industry provides novel dry cabinets which are suitable for rapid drying at relative humidities below one percent.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
Events Calendar | Thu Jul 20 00:00:00 EDT 2023 - Thu Jul 20 00:00:00 EDT 2023 | Suwanee, Georgia USA
Atlanta Chapter Technical Meeting: The Science of Humidity Control in Manufacturing
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smartsonic_ez0_wastewater_evaporator.html
Smart Sonic EZ-0 Smart Sonic EZ-0 Wastewater Evaporator See attached pictures and information below Smart Sonic Model Number
| http://www.thebranfordgroup.com/dnn3/Auction/ALLO0223.aspx
. LEE cutter grinder model A600 Victor surface grinder 1022AD Ramco FM-CO1 surface grinder Clausing Lathe model 8031, 15” Bridgeport Explorer X-26, 3 axis mill Bridgeport vertical mill Telesis Marking Machine TMP6100/090 LSS surface roughness tester SR 300 EMC water evaporator Model 120GSS Misc Lathes, vidmar cabinets
