Electronics Forum | Sat Dec 12 04:47:58 EST 2009 | nkohler
Hello, Somebody would be able to tell it to me, which ones the important differences between the presence examination manners (Classic, ColourMVC, Voting...)? Thanks for your help! Regards, nkohler
Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson
I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If
Electronics Forum | Mon Mar 21 20:29:57 EST 2005 | KEN
Let's examine some scenarios: What if... ...No solder sample available and you must profile a "live" board (rules out epoxy). ...Lead free build (rules out lead bearing alloys)
Electronics Forum | Tue Jul 19 17:48:16 EDT 2005 | saragorcos
One step is to examine the cleanliness on and around the failing component. There could be an ionic contaminant causing the shorts. Regards, Sara Gorcos www.residues.com
Electronics Forum | Thu Aug 30 09:49:32 EDT 2007 | blnorman
EDS @ 10kV maybe going too deep. I've talked to a surface science physicist that recommends Auger spectroscopy because it's more of a true "surface" examination tool.
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Sun Feb 10 15:14:25 EST 2013 | marcelorotofrance
After an in depth examination, I found that the problem was not a defective connector as I thought in the first place. Actually is a broken through-hole on the Quad Align sensor. I requested a spare part to PPM. Mr. Bobpan, thank you again.
Electronics Forum | Fri Jun 03 14:12:09 EDT 2016 | emeto
That looks like a good plan. It will give you the options to examine your product and perform some repairs and/or changes if needed. As a design house you will appreciate that. Good luck!
Electronics Forum | Wed Aug 09 09:29:09 EDT 2017 | edhare
I recommend examining the problem pads and a representative bare board using SEM/EDS to determine if the problem is related to a board solderability issue. I can support this type of analysis (www.semlab.com).
Electronics Forum | Wed Aug 09 09:18:41 EDT 2017 | edhare
I would recommend that you have some of the subject vias micro-sectioned and examined in a SEM to determine exactly what is the nature of the problem. I can support this type of analysis (www.semlab.com).
