Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
Bare Board Inspection Training This 3-day, lectured course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acce
Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson
I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If
The LSM300 follows the successful Laser section Microscopes LSM and LSM2. This new non-contact laser based system is an off-Line solder paste inspection system.LSM300 provides automatic height measurements, eliminating the inconsistencies of manual m
Agilent-Keysight N1735A Agilent/HP N1735A auroraTempo Portable Frame Relay Tester The auroraTempo is essential for installing, configuring and maintaining Frame Relay services running over V-series and DDS interfaces, and T1 and E1 circuits. It
Industry News | 2003-06-23 09:04:32.0
China Replaces Japan and Mexico as Largest Supplier of Electronics to the United States
SMT MACHINE GENUINE JUKI FEEDER SPARE PARTS JUKI FEEDER REEL STOPPER SHAFT E6658706000 JUKI Pats Specifications: Brand Name JUKI FEEDER REEL STOPPER SHAFT Part number E6658706000 Model JUKI CF AF EF ETF ETFR FEEDER SPARE PARTS Ensure Test
40000713 Juki Replacement Parts Ya Pulley Bracket L Assy Smt Machine 2050 2060 Specifications: Brand Name JUKI Part number 40000713 Model Ensure Test in machine confirmation Guarantee 3 month usage for machine 2050 2060 Supply all
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-09-03 17:06:09.0
Both optical and scanning electron microscopy (SEM) are powerful tools for failure analysis in electronics and are used for low and high magnification examination. This article will provide detailed, step by step information for examining solder joints.
Professor Ron Lasky, Ph.D., Phil Zarrow, and Jim Hall discuss the SMT Processes Certification offered by SMTA. http://www.smta.org/certification/ Video production courtesy of Indium Corporation.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Events Calendar | Tue Apr 27 00:00:00 EDT 2021 - Thu Apr 29 00:00:00 EDT 2021 | Ciudad Juárez, Chihuahua, Mexico
SMT Processes Certification Course: Juarez, Mexico
Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Career Center | New York, New York USA | Technical Support
The Bronx Educational Center is intergenerational, culturally responsive, and relevant to the local community. The ABE/GED Teacher reports to the Director of Educational Capacity, at the Bronx Education Center. Responsabilities: Instruct students
Career Center | New York, New York USA | Production,Sales/Marketing
Production Manager: Textile Industry A small fast growing company, located on the south side of Chicago, is looking for a well-organized individual to: �h Direct and coordinate production, processing, and distribution activities. �h Coordinate and
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
menaces (logiciels malveillants, attaques de pirates, spams, espionnage et vol de propriété intellectuelle), examiner les données échangées contre les virus et analyser les données de connexion pour détecter les anomalies et les cas suspects ; ‐ pour