Industry Directory: excess flux after reflow (5)

SIPAD Systems Inc.

SIPAD Systems Inc.

Industry Directory | Manufacturer of Bare PCBs / Assembly / Screen Printing / Soldering

The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.

kurtz ersa Corporation

kurtz ersa Corporation

Industry Directory | Manufacturer of Assembly Equipment / Soldering / Selective Soldering

Manufacturer of Selective Soldering Systems, Ersascope BGA Inspection Systems, BGA Rework Systems, Soldering Irons, Wave Solder and Reflow Equipment.

New SMT Equipment: excess flux after reflow (926)

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

Nordson ASYMTEK

DSP863 HALOGEN FREE No-Clean Lead Free Solder Paste

New Equipment | Solder Materials

863 exhibits excellent wettability, extended stencil life, superior hot slump, and low voiding. Flux class ROL0. Exceeds J-Std-006. 863 provides excellent print definition. Good release is seen on 12-9 mil apertures with print speed of 1.0-6.0 inch p

Qualitek International, Inc.

Electronics Forum: excess flux after reflow (488)

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

flux on PCB's after cleaning

Electronics Forum | Fri Jul 23 14:41:41 EDT 2004 | Steve Stach

Dear JSK, It sounds like the root causes of your problem are two fold. First, excessive heat will polymerize the abietic acid found in rosin forming neo-abietic diamers and polymers which are much less soluble than the parent monomer. There are

Used SMT Equipment: excess flux after reflow (1)

Torch A8N

Torch A8N

Used SMT Equipment | Soldering - Reflow

A8N Main electric part uses international brand components. Temperature control design achieves international advanced level with stable and even temperature. It is suitable for soldering CSP, BGA component. Energy-saving inner oven design and heat

Beijing Torch Co.,Ltd

Industry News: excess flux after reflow (99)

Europlacer Partners with Hexi Electronic Equipment Co., Ltd. to Become a Distributor

Industry News | 2009-04-13 16:22:34.0

DORSET, UNITED KINGDOM - April 2009 - Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it has signed an agreement to distribute Hexi Electronic Equipment Co. Ltd.'s reflow systems.

EUROPLACER

Naveen Ravindran, ZESTRON Americas, to Present at Texas Reliability in Electronics Workshop

Industry News | 2017-09-28 19:59:35.0

ZESTRON is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer, will present “Reflow, Multiple Thermal Cycles and Cleaning No Clean Solder Paste and the Impact on PCB Reliability" at the Reliability in Electronics Workshop on October 17th in Austin, Texas and October 19th, in Richardson, Texas.

ZESTRON Americas

Parts & Supplies: excess flux after reflow (3)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Juki What is SMT? What does SMT mean? What does SMT do?

Juki What is SMT? What does SMT mean? What does SMT do?

Parts & Supplies | Pick and Place/Feeders

The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a

ZK Electronic Technology Co., Limited

Technical Library: excess flux after reflow (300)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: excess flux after reflow (13)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

Nordson ASYMTEK

Removal of baked on fluxes with VIGON® RC 101

Removal of baked on fluxes with VIGON® RC 101

Videos

Based on its MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder ovens. It reliably removes re-condensed fluxes and emissions from assemblies. It is also recommended for

ZESTRON Americas

Events Calendar: excess flux after reflow (1)

Webinar: Solder Paste Evaluation & Simple Tricks of the Trade

Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,

Webinar: Solder Paste Evaluation & Simple Tricks of the Trade

Surface Mount Technology Association (SMTA)

Career Center - Resumes: excess flux after reflow (4)

Arturo C Jadear Jr

Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support

6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

Express Newsletter: excess flux after reflow (910)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM

Partner Websites: excess flux after reflow (314)

Flux - ITW EAE

| https://www.itweae.com/applications/electronic-assembly-materials/flux

Convection Reflow Selective Soldering Electronic Assembly Materials Adhesives Flux Lead-Free No Clean Solder Solder Paste Solvents Water Based Chemistries Solar Cell Firing/Drying Thermal Processing

BGA Cleaning After Balling - BGA / CMO

ZESTRON Americas | https://www.zestron.com/en/cleaning-applications/power-electronics-packages/bga-cleaning.html?%3Bview=article&Itemid=63&option=com_content

BGA Cleaning After Balling - BGA / CMO Contact us log in english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 繁體中文 日本語 한국어 русский

ZESTRON Americas


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