Electronics Forum: exploded solder-joint (4)

solder voids, pin holes.

Electronics Forum | Mon Aug 09 10:27:14 EDT 1999 | Tim Murphy

Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, and/

Strange empty ball on chip component after reflow

Electronics Forum | Thu Nov 30 08:09:19 EST 2006 | INGE

Hi everybody, The matter is this: after reflow, on top side leads of chip components (resistor 0805)appear some empty balls of solder. In some cases this thing is only on the lead and the solder joint seems good, in other cases this empty ball is als

Industry News: exploded solder-joint (1)

Conductive polymer protected due to secrecy by Würth Elektronik offers printed pulse resistors covering different voltage range

Industry News | 2009-08-04 16:55:04.0

Niedernhall, 2009, August 4 – PCB expert Würth Elektronik’s printed pulse resistors achieved the till now claimed impossible high-voltage range of 200,000 V. That has been realised once more by the Würth Elektronik-owned “smart-conductive polymer thick film systems”, outstanding due to a wide variability of resistances.

Würth Elektronik GmbH & Co. KG

Express Newsletter: exploded solder-joint (190)

The Future of Solder Joint Encapsulant

The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced

SMTnet Express - January 14, 2016

SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Solder joint encapsulant adhesives have been

Partner Websites: exploded solder-joint (2063)

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL

Heller Industries Inc.

PCB Libraries Forum : New 2016 Solder Joint Goals

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_new-2016-solder-joint-goals_topic1921.xml

PCB Libraries Forum : New 2016 Solder Joint Goals PCB Libraries Forum : New 2016 Solder Joint Goals This is an XML content feed of

PCB Libraries, Inc.


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