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Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Electronics Forum | Mon Dec 18 13:00:34 EST 2006 | realchunks
Hi John, Depending on your board, it could make a difference. Copper finishes might leave that part of the pad exposed, which is a no-no in most places. Where as a HASL board prolly won't care if you pulled the print back. On the other end, over
Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr
DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste
Industry News | 2023-08-17 14:26:37.0
Today, KINGSUN shares with you the common types and classifications of SMT mounters.
Industry News | 2018-04-18 18:06:14.0
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
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Repair parts include: CPU circuit board repair and maintenance of the I / O board, servo circuit board repair, the image processing circuit board repair, industrial CCD camera repair, frequency converter repair, PLC repair, touch screen repair, laser
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
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• PCB pad contaminated • Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0453-sectioned-3d-ami
. Similar non-uniformity would be more serious in a device exposed to thermal cycling. The second bond pad from the left, however, appears to have no wire bonded to it
