New SMT Equipment: fa missing ,fa damage (227)

3500/34

3500/34

New Equipment | Industrial Automation

Our Business Scope Bently Nevada, ABB,GE,Rockwell,Foxboro, Invensys Triconex, Westinghouse,Schneider Modicon,Siemens,Woodward,GE FANUC, Motorola,Yaskawa,Bosch Rexroth,Rosemount,EPRO,and so on.   Bently Nevada 3500 Machinery Protection Systems

Cambia Automation Limited

3500/33 149986-01

3500/33 149986-01

New Equipment | Industrial Automation

Our Business Scope Bently Nevada, ABB,GE,Rockwell,Foxboro, Invensys Triconex, Westinghouse,Schneider Modicon,Siemens,Woodward,GE FANUC, Motorola,Yaskawa,Bosch Rexroth,Rosemount,EPRO,and so on.   Bently Nevada 3500 Machinery Protection Systems

Cambia Automation Limited

Electronics Forum: fa missing ,fa damage (5)

Dye And Pry on WLP package BGAs

Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira

Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our

Die attach with solder paste

Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.

Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t

Industry News: fa missing ,fa damage (6)

Circuits Assembly Awards Seika Machinery for Test & Inspection – ICT

Industry News | 2014-03-26 08:48:51.0

Seika Machinery, Inc.announces that it has been awarded a 2014 NPI Award in the category of Test & Inspection – ICT for its HIOKI FA1240 Flying Probe Tester.

Seika Machinery, Inc.

Seika to Debut Line Up of New Inspection Equipment at APEX

Industry News | 2014-02-19 16:39:50.0

Seika Machinery, Inc.announces that it will exhibit in Booth #2433 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

Seika Machinery, Inc.

Parts & Supplies: fa missing ,fa damage (22)

Panasonic Panasonic Cm402 12&16mm Feeder with Senser FA0220ABA251338

Panasonic Panasonic Cm402 12&16mm Feeder with Senser FA0220ABA251338

Parts & Supplies | Pick and Place/Feeders

937/5000 1. SMT equipment original/imitation accessories sales: Fuji, Juki, Yamaha, Samsung, Panasonic, and other equipment suction nozzle, Feida and accessories, suction Rod, Suction nozzle Rod, sensor, cutter, belt, filter cotton, sensor, light mo

KingFei SMT Tech

Panasonic CM402/602/NPM 12MM without sensor feeder

Panasonic CM402/602/NPM 12MM without sensor feeder

Parts & Supplies | Pick and Place/Feeders

For Panasonic SMT Spare Parts TAPE FEEDER CM402/602/NPM 12MM without sensor feeder KXFW1KSCA00 FA0020M0000 Product specification: Model  For Panasonic 12MM without sensor Feeder P/N  KXFW1KSCA00 FA0020M0000 Condition  Full New In Stock Standar

Shenzhen Xiangwei Electronic & Technology Co., Ltd.

Technical Library: fa missing ,fa damage (22)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Non-Destructive Test Methods

Technical Library | 2019-09-23 09:35:00.0

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).

ACI Technologies, Inc.

Express Newsletter: fa missing ,fa damage (157)

SMTnet Express - March 31, 2016

SMTnet Express, March 31, 2016, Subscribers: 24,152, Companies: 14,760, Users: 39,935 EMI-Caused EOS Sources in Automated Equipment Vladimir Kraz; OnFILTER, Inc. Electrical overstress causes damage to sensitive components, including latent damage

Partner Websites: fa missing ,fa damage (20)


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